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Stretchable lead and preparation method thereof

A wire and substrate technology, applied in the field of stretchable wire and its preparation, can solve the problems of harsh preparation conditions, complicated preparation process, etc., and achieve the effect of solving the complex preparation process, difficulty in mass production, and simple preparation method

Active Publication Date: 2020-01-24
SHANGHAI MI FANG ELECTRONICS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, processes such as screen printing and transfer printing are usually used to prepare stretchable liquid metal conductive circuits on flexible substrates, but the preparation process of this process is complicated and the preparation conditions are harsh.

Method used

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  • Stretchable lead and preparation method thereof
  • Stretchable lead and preparation method thereof
  • Stretchable lead and preparation method thereof

Examples

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preparation example Construction

[0031] In the second aspect of the embodiment of the present invention, there is provided a method for preparing the stretchable wire according to the first aspect of the embodiment of the present invention, the method includes: using a semi-cured flexible material to prepare a substrate with grooves; making the semi-cured flexible material The cover plate is bonded to the base to seal the grooves on the base to form a sealed hollow pipe; the liquid metal is injected into the hollow pipe so that the liquid metal is distributed in the hollow in a flowing state In the pipe, a metal circuit layer is obtained; the hollow pipe with the metal circuit layer is solidified to obtain a stretchable wire.

[0032] In the embodiment of the present invention, a hollow pipe is made by using a base and a cover formed of a semi-cured flexible material, and the liquid metal is injected into the hollow pipe and then solidified to obtain a stretchable wire; thereby realizing rapid and large-scale ...

Embodiment 1

[0053] A stretchable wire includes: a substrate made of semi-cured PDMS, a cover plate made of semi-cured PDMS and a metal circuit layer formed of a gallium-based alloy. There are linear grooves on the substrate; the cover plate and the substrate are bonded and connected to seal the linear grooves to form a sealed hollow pipe; the gallium-based alloy is distributed in the hollow pipe in a flowing state to form a metal circuit layer for conducting through the circuit.

[0054] In the embodiment of the present invention, there is no limitation on the preparation method of the stretchable wire, as long as the stretchable wire can be obtained.

Embodiment 2

[0056] A stretchable wire includes: a substrate 10 made of semi-cured silicone rubber, a cover plate 20 made of semi-cured silicone rubber, and a metal circuit layer 30 formed of a liquid composite material of indium-based alloy and Ni nanoparticles. The substrate 10 is provided with linear grooves; the cover plate 20 and the substrate 10 are bonded and connected, and are used to encapsulate the linear grooves to form a sealed hollow pipe; the liquid composite material of indium-based alloy and Ni nanoparticles is distributed in a flowing state. A metal circuit layer 30 is formed in the hollow pipe for conducting the circuit.

[0057] The preparation method of the stretchable wire in the embodiment of the present invention is as follows:

[0058] Step 1: Use Teflon material as the template material to construct a template with linear grooves; spread the substrate made of semi-cured silicone rubber on the template and take it out after applying force to obtain a substrate with ...

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Abstract

The invention discloses a stretchable lead and a preparation method thereof. The specific embodiment of the stretchable lead comprises: a substrate made of a semi-cured flexible material, wherein thesubstrate is provided with a groove; a cover plate made of the semi-cured flexible material, wherein the cover plate is bonded and connected with the substrate and is used for encapsulating the grooveto form a sealed hollow pipeline; and a metal circuit layer formed by liquid metal and distributed in a flowing state in the hollow pipe and used for conducting a circuit. The sealed hollow pipe is formed by attaching the cover plate of the semi-cured flexible material to the semi-cured flexible material substrate with the groove, and the metal circuit layer is formed through combination with theliquid metal injected into the hollow pipe so that the stretchable wire with adjustable shape can be obtained through the action of physical force and then the stretchable wire with extremely fine diameter can be obtained.

Description

technical field [0001] The invention relates to the technical field of wire preparation, in particular to a stretchable wire and a preparation method thereof. Background technique [0002] General metal materials tend to have very high melting points, while some metal materials, such as mercury, remain liquid at room temperature. Although mercury can remain liquid at room temperature, it is highly toxic and not suitable for use in the human body. Like mercury, gallium and its alloys with indium have low melting points. Gallium-indium alloy has a wide liquid temperature range and is chemically stable. Due to the low melting point of liquid metal, it has the electrical conductivity, thermal conductivity and radiographic ability of metal, as well as the fluidity and compliance of liquid; therefore, liquid metal is the best choice for stretchable wires. However, due to the relatively high surface tension and weak adhesion of liquid metal, it is difficult to prepare liquid met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B7/00H01B7/06H01B7/17H01B13/00H01B13/22
CPCH01B7/0027H01B7/06H01B7/17H01B13/00H01B13/0003H01B13/221
Inventor 蓝河任大勇李胜夏
Owner SHANGHAI MI FANG ELECTRONICS LTD
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