A method for chemical nickel-gold surface treatment of polyphenylene ether-containing printed circuit boards

Abstract

The invention discloses a method for surface treatment of polyphenylene ether-containing printed circuit boards with chemical nickel and gold in the technical field of surface treatment of printed circuit boards. After treatment, there is a technical problem of chemical nickel blond degolding, including data analysis and optimized design of the inner layer of the circuit board; printing the inner layer of the printed circuit board and pressing the circuit board; mechanical drilling of the outer layer of the circuit board, electroplating copper and the outer layer Graphics production; perform baking process; ink production; perform baking process; perform electroless nickel gold treatment. The present invention ensures the reduction of material precipitates by adding shielding copper foil and dummy pads on the sub-outer layer, adding a baking process to the plate after etching, and adding baking to the plate after etching, so as to ensure the reduction of material precipitates, thereby ensuring that the chemical nickel and gold work, It has the least impact on nickel deposition, and at the same time reduces the influence of the baking process on the non-through hole dipping process and the deep drilling resin plugging process dipping gold by secondary drilling and ink coverage.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of printed circuit boards, and in particular relates to a method for chemical nickel-gold surface treatment of printed circuit boards containing polyphenylene ether. Background technique [0002] With the increase in the use of high-speed materials for printed circuit boards (Printer circuit board / PCB), the use of high-speed materials containing PPO (polyphenylene ether) is also increasing. Due to the consideration of assembly factors, the surface treatment of printed circuit boards It is chemical nickel gold, and when it is designed in this way, the residual small molecule solvent in the material will volatilize and precipitate out during the production process, and when the nickel bath reacts, these small molecule substances will affect the deposition of nickel, on the substrate and copper pad Thin plating is produced at the handover position, and the nickel deposition at this position...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for surface treatment of polyphenylene ether-containing printed circuit boards with chemical nickel and gold, so as to solve the problem of chemical nickel-gold whitening of polyphenylene ether-containing printed circuit boards in the prior art after chemical nickel-gold treatment Technical problems of degolding

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