Method for coating phosphor powder layer on LED chip and manufacture of LED device

Abstract

The invention provides a method for coating a phosphor powder layer on an LED chip, which comprises the following steps: preparing a substrate, and preparing phosphor powder mixed glue, wherein the substrate is provided with the LED chip; preparing a die, arranging the substrate in the die, closing the die and applying pressure to form a cavity between the substrate and the die, wherein the die is provided with a colloid passage and a die cavity corresponding to the position of the LED chip; injecting the phosphor powder mixed glue into the die cavity along the colloid passage, and making the phosphor powder mixed glue cover the LED chip and fill the cavity; solidifying and molding the phosphor powder mixed glue in the cavity; and after the injected phosphor powder mixed glue is solidified, separating the die from the substrate to make the phosphor powder mixed glue separated from the die and combined on the substrate so as to form the phosphor powder layer. The method for forming the phosphor powder layer by a die injection molding method has good consistency and simple process, and is suitable for mass production. In addition, the invention also provides a method for manufacturing an LED device based on the method for coating the phosphor powder layer on the LED chip.

Description

technical field [0001] The present invention relates to a method for coating phosphor powder and a method for manufacturing a semiconductor device, in particular to a method for coating a phosphor layer on a light emitting diode (Light Emitting Diode, LED) chip and the manufacture of an LED device based on the method method. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a solid-state semiconductor device that can directly convert electricity into light. Because LEDs do not contain mercury, are small in size, long in life, fast in response, environmentally friendly, energy-saving, and have high color saturation, they are used more and more widely. The later third-generation lighting sources are widely used in liquid crystal projection devices, mobile phone backlights, and display screens. [0003] At present, there are many ways for LEDs to produce white light. One of them is that the blue chip excites the yellow phosphor powder to mix ...

AI Technical Summary

Problems solved by technology

However, due to factors such as the instability of the air pressure and the precipitation of the phosphor powder in the actual production process, the consistency of the phosphor powder distributed on each LED chip is relatively poor.

With the development of science and technology, some new coating processes have also appeared in recent years: 1) as the publication number of CN1897312 in the Chinese Invention Patent Application Publication, a vacuum sputtering coating phosphor process is disclosed, although it has the advantage of uniform coating , but due to the influence of the physical characteristics of phosphor particles, the possibility of this process is very small, and the cost is relatively high; 2) For example, the patent document of US Patent Publication No. 20030181122 discloses a patterned coating for photolithography development Phosphor powder technology, although the phosphor coating structure can be adjusted according to the characteristics of the chip, but due to the influence of the characteristics of the photoresist material, the luminous efficiency of the product decays quickly; The impact of powder precipitation also has the problem of difficult control of consistency, which is not suitable for mass production

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