Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A high thermal conductivity polydopamine modified boron nitride/polyimide composite material and its preparation method

A technology of polydopamine and polyimide, applied in the direction of heat exchange materials, chemical instruments and methods, etc., to achieve the effect of easy implementation, simple components, and improved thermal conductivity

Active Publication Date: 2022-01-28
NORTHWESTERN POLYTECHNICAL UNIV
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through the investigation of relevant literature and patents, there is no report on the same or similar high thermal conductivity BN@PDA / PI composite material and its preparation method as this patent

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high thermal conductivity polydopamine modified boron nitride/polyimide composite material and its preparation method
  • A high thermal conductivity polydopamine modified boron nitride/polyimide composite material and its preparation method
  • A high thermal conductivity polydopamine modified boron nitride/polyimide composite material and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

example 1~4 and comparative example 1~5

[0028] (1) Preparation of BN@PDA: Disperse 4 g of BN (BBN-30, product of Ya’an Baitu High-tech Materials Co., Ltd.) powder in 260 mL of deionized water, and then add 10 mmol (1.2114 g) of tris(hydroxymethyl) After aminomethane is completely dissolved, add 100 mL of absolute ethanol, 40 mL of hydrochloric acid (0.1 mol / L) in turn while stirring, and finally add 640 mg of dopamine hydrochloride, and stir magnetically for 6 h. The obtained BN@PDA dispersion was centrifuged and washed 4 times with ethanol / water mixture at 4000 rpm. After suction filtration, the BN@PDA modified filler was obtained after drying at 70 °C for 12 h;

[0029] (2) Preparation of PI solution: PI raw material (Ultem 1000, product of SABIC Innovative Plastics Co., Ltd.) was added to a certain amount of DMAc, and magnetically stirred at 120 °C for 10 h to obtain a PI solution with a solid content of 25 %;

[0030] (3) Preparation of BN@PDA / PI / DMAC blend: Take a certain mass of BN@PDA (Example) or BN (Compar...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
sizeaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

This description discloses a high thermal conductivity polydopamine modified boron nitride / polyimide (BN@PDA / PI) composite material and its preparation method, which belongs to the field of high performance thermal conductivity composite material preparation, including polyimide (PI, 68.9~91.3 wt%) and polydopamine-modified boron nitride (BN@PDA, 8.7~31.1 wt%), the content of PDA in the modified filler BN@PDA is 1.46 wt%; Coating BN to obtain modified filler BN@PDA, and then blending it with PI solution can improve the interface with PI by introducing hydrogen bonds, inhibit agglomeration and reduce interface thermal resistance, and then vacuum-assisted suction filtration, The in-plane orientation of BN@PDA in the PI matrix is ​​prepared, and then hot-pressed into a composite material at an appropriate temperature and pressure, which can reduce the defects of the composite material and further improve the in-plane orientation of BN@PDA in the PI matrix , endowing the composite with excellent in-plane thermal conductivity.

Description

technical field [0001] The invention relates to a polydopamine-modified boron nitride / polyimide (BN@PDA) with low interfacial thermal resistance and high in-plane orientation of the filler prepared by the process of "filler surface modification, vacuum-assisted suction filtration, and hot-press forming". / PI) composite material and its preparation method, thus endowing the BN@PDA / PI composite material with high thermal conductivity. This patent belongs to the field of preparation of high-performance heat-conducting composite materials. Background technique [0002] With the development of modern electronic equipment in the direction of miniaturization, integration, and multi-function, if the heat generated during operation is difficult to discharge in time, it will cause the local temperature of the equipment to be too high, which will seriously affect the reliability and service life of the equipment. Polyimide (PI) is widely used in aerospace, electronic devices and other...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K9/10C08K3/38C09K5/14
CPCC08K9/10C08K3/38C09K5/14C08K2003/385C08L79/08
Inventor 陈妍慧丁栋梁尚志慧李剑闵超刘振国张秋禹
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com