A 3D Integrated Filter Based on Through-Glass Vias

Abstract

The invention discloses a three-dimensional integrated filter based on glass through holes. The filter comprises a first layer, a second layer, a third layer and a fourth layer, wherein the first layer comprises first metal plates and first metal wires, and the plurality of first metal plates are connected with the first metal wires; the second layer comprises a dielectric substrate and a second metal plate, the dielectric substrate is arranged above the first metal plates and the first metal wires, and the second metal plate is arranged in the dielectric substrate; the third layer comprises aglass substrate and glass through holes, the glass substrate is arranged above the second layer, and the glass through holes penetrate through the glass substrate; the fourth layer comprises a thirdmetal plate and a second metal wire, the second metal wire is arranged above the third layer and defines a second area structure, and the third metal plate is arranged in the second area structure. According to the invention, a three-dimensional spiral inductor and a plate capacitor are constructed based on the glass through holes, and an equivalent filter structure formed by series-parallel connection of the three-dimensional spiral inductor and the plate capacitor is compact in structure, small in size, convenient to integrate and flexible in design.

Description

technical field [0001] The invention belongs to the technical field of radio frequency / microwave integrated circuits, and in particular relates to a three-dimensional integrated filter based on through-glass holes. Background technique [0002] In radio frequency integrated circuits, filters, as an indispensable frequency selection component in communication systems, play a very important role and are widely used in various radio frequency integrated circuits. [0003] Filters are critical to improving the overall operating quality of a communication system. With the increasing demand for high-speed wireless mobile communication and high-performance chips, the development of filters with smaller size and lighter weight is very urgent. At present, the existing integrated filters are mainly composed of planar capacitors and inductors composed of top-layer metals, which can meet broadband performance and channel isolation. However, with the rapid development of three-dimension...

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Problems solved by technology

[0004] At present, the existing integrated filters are mainly composed of planar capacitors and inductors made of top-layer metal, which occupy too much chip area, resulting in too large filter volume, and it is difficult to reduce the weight of the system

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