Automatic welding and packaging equipment for glass-encapsulated temperature sensors

Abstract

A glass-encapsulated temperature sensor automatic welding and packaging equipment, including a conveying platform, on which, from left to rear, there are successively a transfer jig lowering mechanism, a straightening and shearing mechanism, a silver dipping mechanism, a chip welding mechanism, a silver baking mechanism, Glass bulb inserting mechanism and glass sealing forming mechanism; straightening and shearing mechanism, silver dipping mechanism, chip welding mechanism, and glass bulb inserting mechanism are intersected with the first transfer jig conveying mechanism, silver baking mechanism, and glass sealing forming mechanism There is a second transfer jig conveying mechanism. The invention provides an automatic welding and packaging device for a glass-encapsulated temperature sensor, which can realize automatic processing of the glass-encapsulated temperature sensor.

Description

technical field [0001] The invention relates to the production field of glass-encapsulated temperature sensors, in particular to automatic welding and packaging equipment for glass-encapsulated temperature sensors. Background technique [0002] In the production process of NTC thermistor, the following process needs to go through: Dumet wire straightening --> straightening --> clamping wire --> cutting --> jig transfer --> cutting --> dipping silver -- ->Adhesive film-->Preheating-->Baking silver-->Insert glass tube-->Preheating-->High temperature forming-->Flip-->Preheating-->High temperature forming-->Receiving . [0003] The wire pins used by NTC thermistors are Dumet wires, and the diameter of Dumet wires is less than 0.3m / m. The Dumet wires are nickel-iron alloys with copper plating and are generally used in the diode or light bulb (tube) industry. Because the Dumet wire is nickel-iron alloy, the wire diameter is small a...

AI Technical Summary

Problems solved by technology

[0005] During the bonding process, it is necessary to weld the front and back sides of the chip with a length and width of several millimeters with Dumet wire, and the existing equipment does not provide a foundation

[0006] In addition, how to perfectly fuse the cylindrical glass shell with the internal chip and Dumet wire after inserting the glass shell and ensure that the cylindrical glass shell is elliptical, the existing equipment cannot do this

[0007] From the systematic molding process of straightening, cutting, dipping silver, soldering chips, baking silver, inserting glass tubes and high-temperature molding, the existing technology has not given a good solution for reference

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