Preparation method of phase-change heat dissipation material with high thermal conductivity and high insulation performance

Abstract

The invention discloses a preparation method of a phase-change heat dissipation material with high thermal conductivity and high insulation performance, and belongs to the field of electronic materials. The preparation method of the phase-change heat dissipation material with high thermal conductivity and high insulation performance comprises the following steps: uniformly mixing spherical aluminum oxide I, spherical aluminum oxide II, irregular aluminum oxide and zinc oxide to obtain a mixture A; adding a surface treating agent into the obtained mixture A, and uniformly mixing to obtain a mixture B; melting polyethylene wax in a high-temperature environment, adding the mixture B, and fully and uniformly mixing to obtain a mixture C; carrying out vacuum pumping and bubble discharging treatment on the mixture C; and carrying out high-temperature calendaring molding on the treated mixture C. According to the preparation method of the phase-change heat dissipation material with high thermal conductivity and high insulation performance, the phase-change heat dissipation material is applied to electronic products, so that the conditions of short circuit and the like caused by electric breakdown of the electronic products are avoided, and the phase-change heat dissipation material is high in yield, free of by-products, recyclable in leftover materials and easy to process.

Description

Technical field [0001] The invention relates to the technical field of electronic materials, in particular to a method for preparing a phase change heat dissipation material with high thermal conductivity and high insulation. Background technique [0002] Thermally conductive phase change materials are heat-enhanced polymers designed to minimize the thermal resistance between power-consuming electronic devices and the heat sink connected to them. There are many types of phase change materials that can be used as phase change materials. There are more than 20,000 substances, and the application range of thermally conductive phase change materials is quite wide, such as microprocessors, memory modules, DC / DC converters, IGBT components, power modules, power semiconductor devices, solid state relays, bridge rectifiers, high-speed buffers Memory chips etc. [0003] However, the existing thermally conductive phase change materials use metal powder to increase the thermal conductivity, ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a method for preparing a phase change heat dissipation material with high thermal conductivity and high insulation, which solves the problems of poor insulation performance, high phase change temperature and poor wettability of the phase change material proposed in the above background technology