Single crystal film with silicon nitride layer and preparation method thereof
A technology of silicon nitride layer and single crystal thin film, which is applied in the direction of light guide, optics, instrument, etc., can solve the problems of high loss and poor film performance, and achieve the effect of low loss, small thickness deviation and controllable thickness
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[0034] The application also includes a method for preparing a single crystal thin film with a silicon nitride layer, the flow process is as follows image 3 shown, including the following steps:
[0035] ① Deposit a layer of silicon nitride on the sacrificial silicon substrate by LPCVD to obtain the first thin film;
[0036] ②Prepare the second film (such as figure 2 Shown); wherein the lithium niobate / lithium tantalate thin film surface has been polished;
[0037] ③ bonding the silicon nitride layer of the first film and the lithium niobate / lithium tantalate film layer of the second film to obtain a bonded body;
[0038] ④ Grinding step ③ The sacrificial silicon substrate in the obtained bonding body is 10-20 μm, and the sacrificial silicon substrate is removed by a wet etching process to obtain a single crystal film with a silicon nitride layer.
[0039] In the preferred preparation method, in step ③, the way of bonding the silicon nitride layer of the first film and the...
Embodiment 1
[0049] A single crystal thin film with a silicon nitride layer, including a silicon nitride layer, a lithium niobate thin film layer, a silicon oxide layer and a silicon substrate layer from top to bottom; wherein the thickness of the silicon nitride layer is 50nm, and the lithium niobate thin film The thickness of the layer is 100nm, the thickness of the silicon oxide layer is 50nm, and the thickness of the silicon substrate layer is 0.2mm; the thickness deviation of the silicon nitride layer is ≤3%, the roughness Ra<0.2nm, and the uniformity TTV<50nm.
Embodiment 2
[0051] A single crystal thin film with a silicon nitride layer, including a silicon nitride layer, a lithium tantalate thin film layer, a silicon oxide layer and a silicon substrate layer from top to bottom; wherein the thickness of the silicon nitride layer is 2 μm, and the lithium niobate thin film The thickness of the layer is 1 μm, the thickness of the silicon oxide layer is 5 μm, and the thickness of the silicon substrate layer is 1 mm; the thickness deviation of the silicon nitride layer is ≤3%, the roughness Ra<0.2nm, and the uniformity TTV<50nm.
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