Polishing device

Abstract

The invention provides a polishing device. The polishing device comprises a bearing mechanism and a first polishing mechanism, wherein the bearing mechanism is used for bearing a wafer; the first polishing mechanism comprises at least one set of rotating first polishing wheels, a first polishing groove extending in the circumferential direction is formed in each first polishing wheel, each set offirst polishing wheels comprises the two first polishing wheels, the two first polishing wheels in each set are symmetrically arranged with respect to the wafer, and the axes of the two first polishing wheels share the same surface with the axis of the wafer; and the two first polishing wheels in each set can be close to or away from the wafer so as to make the inner side wall of each first polishing grooves be propped against or away from the wafer. According to the polishing device, the wafer is polished through the first polishing grooves in the two symmetrically-arranged first polishing wheels, the wafer can be kept stable and balanced in the polishing process, the vibration of the wafer is reduced, the precision degree of wafer processing is improved, the polishing efficiency is accelerated, and the polishing quality of the wafer is improved.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a grinding device. Background technique [0002] Usually, the edge of a wafer after wire dicing is sharp, and when observed finely, there are fine debris, and therefore, when the next process is performed, the chip will cause cracks and breakage of the wafer. In addition, the outer diameter of the ingot before wire cutting is about 0.5 to 1.0 mm larger than the final outer diameter. For this reason, the edge grinding process uses a grinding wheel with a certain grain size to grind the surface of the edge to remove its damage and process the outer diameter of the desired size, and the general method is suitable for edge grinding using a grinding wheel with a certain grain size. When there is more silicon material to be removed, the processing time is relatively longer. When processing is performed on only one side, the efficiency of wafer grinding is low, and it is easy to cause ...

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a grinding device to solve the problem that the processing precision of the wafer is reduced due to the vibration of the wafer and the unbalanced processing load during the wafer grinding process.

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