Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Structural component of electronic product and preparation method thereof and electronic product

A technology for electronic products and structural components, applied to the structural components of electronic products and their preparation and the fields of electronic products, can solve the problems of difficult direct die-casting and high gloss of copper alloys

Inactive Publication Date: 2019-12-10
BYD CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the problem that the copper alloy existing in the prior art is difficult to be directly die-cast into high-gloss, structural parts of electronic products with good appearance effects, etc., to provide a structural part of electronic products and its preparation method and electronic product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Structural component of electronic product and preparation method thereof and electronic product
  • Structural component of electronic product and preparation method thereof and electronic product
  • Structural component of electronic product and preparation method thereof and electronic product

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0018] The invention provides a method for preparing a structural component of an electronic product, the method comprising:

[0019] (1) Die-cast the copper alloy raw material composition to obtain the first product of the structural parts of the electronic product; based on the total weight of the copper alloy raw material composition, the copper alloy raw material composition includes Cu 30-50% by weight, Mn 25-40% by weight, Al 4-6% by weight, Ni 10-17% by weight, Si 0.01-10% by weight and Be 0.001-0.03% by weight;

[0020] (2) Immersing the initial structural parts of the electronic product obtained in step (1) in a solution of a protective agent, the protective agent including benzotriazole and 2-mercaptobenzothiazole;

[0021] (3) The structural components of the electronic products are obtained by surface-treating the primary structural components of the electronic products impregnated in step (2).

[0022] The present invention uses a specific protective agent to imp...

Embodiment 1

[0054] This embodiment is used to illustrate the preparation method of the structural components of the electronic product of the present invention.

[0055] 1. Preparation of molded products

[0056] Based on the total weight of the copper alloy raw material composition, the alloy raw materials of 40% by weight of Cu, 30% by weight of Mn, 5% by weight of Al, 16% by weight of Ni, 8.99% by weight of Si and 0.01% by weight of Be are under vacuum condition 3Pa Melting, the melting temperature is 1200°C, pouring, cooling, and die-casting after smelting to obtain the first structural parts of electronic products; among them, the process conditions of die-casting are that the temperature of the casting liquid is 960°C, and the injection speed is 1.5m / s, the mold cavity temperature is 250°C, the holding time is 5s, the starting point of the first injection is 145mm, and the starting point of the second injection is 190mm.

[0057] 2. A method for preparing a structural component of...

Embodiment 2

[0066] This embodiment is used to illustrate the preparation method of the structural components of the electronic product of the present invention.

[0067] 1. Preparation of molded products

[0068] Based on the total weight of the copper alloy raw material composition, the alloy raw materials of 30% by weight of Cu, 40% by weight of Mn, 6% by weight of Al, 17% by weight of Ni, 6.97% by weight of Si and 0.03% by weight of Be were placed under vacuum condition 5Pa Melting, the melting temperature is 1250°C, pouring, cooling, and die-casting after smelting to obtain the primary structural parts of electronic products; among them, the process conditions of die-casting are that the temperature of the casting liquid is 950°C, and the injection speed is 0.8m / s, the mold cavity temperature is 200°C, the holding time is 3s, the starting point of the first injection is 145mm, and the starting point of the second injection is 190mm.

[0069] 2. A method for preparing a structural co...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a structural component of an electronic product and a preparation method thereof and the electronic product. The preparation method for the structural component of the electronic product comprises the steps that (1) a copper alloy raw material composite is die-cast and molded, and a preliminary product of the structural component of the electronic product is acquired; and with the total weight of the copper alloy raw material composite as the benchmark, the copper alloy raw material composite comprises, by weight, 30-50% of copper, 25-40% of manganese, 4-6% of aluminum,10-17% of nickel, 0.01-10% of silicon and 0.001-0.03% of beryllium; (2) the preliminary product of the structural component of the electronic product is soaked in a protective agent solution, whereinthe protective agent comprises benzotriazole and 2-mercaptobenzothiazole; and (3) the structural component of the electronic product is acquired through surface treatment. The structural component ofthe electronic product can pass a salt spray test and is suitable for manufacturing electronic products with high surface accuracy requirements.

Description

technical field [0001] The invention relates to a structural part of an electronic product, a preparation method thereof and the electronic product. Background technique [0002] Copper alloy is an alloy composed of pure copper as the base and adding one or several other elements. For example, brass is an alloy composed of copper and zinc, and white copper is a copper alloy with nickel as the main added element. Existing copper alloys are difficult to directly die-cast complex structural parts with high gloss and good appearance effects, especially difficult to form mobile phone shells, mobile phone middle frames and other parts that require good appearance effects. Therefore, the application of copper alloys in electronic products is limited . Contents of the invention [0003] The purpose of the present invention is to overcome the problems existing in the prior art that copper alloys are difficult to directly form high-gloss, structural parts of electronic products wit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22C30/02B22D17/00C22C9/05C23C22/00H04M1/02H04M1/18
CPCB22D17/00C22C9/05C22C30/02C23C22/00H04M1/02H04M1/18
Inventor 张春萌菅永喜郭强
Owner BYD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com