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Chuck table

Pending Publication Date: 2019-12-03
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to form a plated layer with a thickness of 200 μm, it is suitable for electroplating, but the material that can be electroplated is prone to thermal deformation
Therefore, when each part of the chuck table is formed of a material that can be plated, there is a problem that the support pins and the like are thermally deformed due to the processing heat generated during tool turning, and the plate-shaped workpiece held cannot be uniform thickness
[0007] Therefore, there is a problem of forming a plated layer that does not peel off during turning on a material that is not easily deformed by heat in the pin chuck table.

Method used

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Embodiment Construction

[0025] figure 1 The machining apparatus 1 shown is an apparatus for turning a plate-shaped workpiece W held on a chuck table 30 of the present invention by a tool turning unit 6 having a tool tool 64 . The front side (-Y direction side) on the base 10 of the processing device 1 is used as an area for loading and unloading the plate-shaped workpiece W with respect to the chuck table 30, and the rear side (+Y direction side) on the base 10 is used as an area for turning the workpiece W by a tool. The unit 6 is an area where the turning process of the plate-shaped workpiece W held on the chuck table 30 is performed.

[0026] figure 1 The illustrated plate-shaped workpiece W is, for example, a semiconductor wafer having a circular outer shape with silicon as a base material, but is not limited thereto. In addition, the upper surface Wa of the plate-shaped workpiece W serves as a surface to be processed by turning. The lower surface Wb of the plate-shaped workpiece W is protecte...

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PUM

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Abstract

Provided is a chuck table. In a pin chuck table, a plating layer that does not peel off during turning is formed on a material that is not susceptible to thermal deformation. The chuck table (30) usedin a machining device (1) for turning an upper surface (Wa) by means of a tool (64) by holding a lower surface (Wb) of a plate-shaped workpiece (W) by suction has: an outer circumferential annular wall (300) for supporting an outer circumferential portion of the lower surface of the plate-shaped workpiece by means of the annular upper surface (300a); a suction recess (301) formed on the inside ofthe outer peripheral annular wall (300) and having a lower bottom surface (301b) than the upper surface of the outer peripheral annular wall; a suction port (301c) that is formed in the bottom surface of the suction recess (301) and communicates with a suction source (36); and a plurality of support pins (304) vertically formed in the bottom surface (301b) at equal intervals in a manner of avoiding the suction port; the upper surface (304a) of the support pins and the upper surface (300a) of the outer peripheral annular wall (300) are at the same height, and plating layers (M) are formed on the side surfaces (300c, 300d) and the upper surface (300a) of the outer peripheral annular wall and on the side surfaces (304c) and the upper surface (304a) of the support pins (304).

Description

technical field [0001] The present invention relates to a chuck table for holding a plate-shaped workpiece. Background technique [0002] A chuck table used in a processing device for turning a plate-shaped workpiece using a tool tool includes, for example, an outer peripheral annular holding portion formed on the outer peripheral side; and a suction concave portion formed inside the outer peripheral annular holding portion. , communicating with the suction unit; and a plurality of support pins formed in the suction concave portion (for example, refer to Patent Document 1). The chuck workbench configured in this way supports the plate-shaped workpiece through a plurality of support pins. Since the support pins have a small supporting area, foreign matter such as dust will not be caught between the support pins and the plate-shaped workpiece, and it can be flat Holds plate-like workpieces. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2005-333067 [0004] The c...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687H01L21/304
CPCH01L21/683H01L21/68714H01L21/68757H01L21/304H01L21/3043H01L21/6838H01L21/6835H01L21/68742H01L21/68785
Inventor 森俊波冈伸一
Owner DISCO CORP
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