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Rigid-flex circuit board opening method

A combination of soft and hard, circuit board technology, applied in the direction of printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., can solve the problems of large cost burden of circuit board manufacturers, high processing precision requirements, high skill requirements of employees, etc., to reduce pollution and energy consumption, reduce precision requirements, and reduce production costs

Inactive Publication Date: 2019-11-08
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the main method of opening the cover is laser cutting + manual prying. This method not only requires high processing accuracy, low production efficiency, and causes environmental pollution, but also requires high skills for employees. When removing the cover, it is easy to damage the soft board and cause the product to be scrapped. Circuit board manufacturers bring a large cost burden

Method used

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  • Rigid-flex circuit board opening method
  • Rigid-flex circuit board opening method

Examples

Experimental program
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Effect test

Embodiment 1

[0027] see figure 1 , this embodiment includes the following steps:

[0028] S1, prepare in advance the flexible board 5 laminated from the inside out, the second layer of non-flowing PP sheet 4, the FR4 light board 3, the first layer of non-flowing PP sheet 2 and the circuit layer 1, and the circuit layer 1 is provided with The opening area 7, the opening area 7 corresponds to the exposed flexible board area on the soft-rigid circuit board, and the position corresponding to the opening area 7 on the FR4 light board 3 is provided with a first window 8, the first window A spacer 6 is placed inside 8, and a second window 9 is opened on the position corresponding to the opening area 7 on the second layer of non-flowing glue PP sheet 4;

[0029] S2, the circuit layer 1 prepared in step S1, the first layer of non-flowing PP sheet 2, FR4 light board 3, the second layer of non-flowing PP sheet 4, the soft board 5, the second layer of non-flowing PP sheet 4, FR4 The light board 3, t...

Embodiment 2

[0041] This embodiment includes the following steps:

[0042] S1, prepare in advance the flexible board 5 laminated from the inside out, the second layer of non-flowing PP sheet 4, the FR4 light board 3, the first layer of non-flowing PP sheet 2 and the circuit layer 1, and the circuit layer 1 is provided with The opening area 7, the opening area 7 corresponds to the exposed flexible board area on the soft-rigid circuit board, and the position corresponding to the opening area 7 on the FR4 light board 3 is provided with a first window 8, the first window A spacer 6 is placed inside 8, and a second window 9 is opened on the position corresponding to the opening area 7 on the second layer of non-flowing glue PP sheet 4;

[0043] S2, the circuit layer 1 prepared in step S1, the first layer of non-flowing PP sheet 2, FR4 light board 3, the second layer of non-flowing PP sheet 4, the soft board 5, the second layer of non-flowing PP sheet 4, FR4 The light board 3, the first layer o...

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Abstract

The invention discloses a rigid-flex circuit board opening method, which comprises the following steps: S1, a flexible board, a second-layer no-glue flow PP sheet, an FR4 light board, a first-layer no-glue flow PP sheet and a circuit layer which are arranged from inside to outside are prepared in advance; S2, the circuit layer, the first-layer no-glue flow PP sheet, the FR4 light board, the second-layer no-glue flow PP sheet, the flexible board, the second-layer no-glue flow PP sheet, the FR4 light board, the first-layer no-glue flow PP sheet and the circuit layer prepared in the step S1 are stacked in sequence and are laminated; S3, the laminated board prepared in the step S2 is subjected to drilling, electroplating, outer layer line and anti-welding process treatment; S4, a numerical control milling machine is used to perform opening treatment on an opening area of the laminated board prepared in the step S3, a pad is taken out, and a semi-finished product of a rigid-flex circuit board is obtained; and S5, the semi-finished product of the rigid-flex circuit board prepared in the step S4 is subjected to surface treatment, flexible board reinforcement and flying probe processes, and a rigid-flex circuit board is obtained. The opening processing depth precision requirements can be reduced, the production efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of processing a rigid-flex circuit board, in particular to a method for opening a rigid-flex circuit board. Background technique [0002] With the development trend of thinner, more integrated and multi-functional consumer electronic products, its requirements for the production process of printed circuit boards are getting higher and higher. The birth and development of FPC and PCB have given birth to the new technology of soft and hard circuit boards. product. Rigid-flex circuit board is a flexible circuit board and a rigid circuit board. After lamination and other processes, they are combined according to relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. It has flexibility and three-dimensional wiring. , Change the shape according to the space limit, reduce the use of connectors when assembling electronic products, greatly increase the reliability, re...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0044H05K3/4691
Inventor 李亚军杨旭东孟伟
Owner AOSHIKANG TECH CO LTD
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