Horizontal glue residue removal and copper assembly line and glue residue removal and copper method

An assembly line and slag technology, applied in the secondary treatment of printed circuits, grinding machines, metal processing equipment, etc., can solve the problem of increasing the length of desmear and copper removal lines, the efficiency of desmear and copper removal, low quality, Not suitable for installation and use in small factories

Active Publication Date: 2019-11-05
SHENZHEN CYPRESS IND DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] But at present, in the desmearing and copperizing steps, the plate is usually driven by horizontal movement. In order to ensure that the plate can fully carry out the chemical reaction, the length of the equipment corresponding to the desmearing and copperizing steps is generally longer. As a result, the length of the entire desmear and copper removal line is increased, so that it is not suitable for installation and use in general small factories, and the efficiency and quality of desmear and copper treatment are not high, so it needs to be improved

Method used

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  • Horizontal glue residue removal and copper assembly line and glue residue removal and copper method
  • Horizontal glue residue removal and copper assembly line and glue residue removal and copper method
  • Horizontal glue residue removal and copper assembly line and glue residue removal and copper method

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Embodiment 1

[0070] Reference figure 1 , Is a horizontal desmearing and copper smelting assembly line disclosed by the present invention, including: an automatic plate placing machine 101 and a plate grinding unit 102. The automatic board placement machine 101 is used to input the stacked plates horizontally one by one. The plate grinding unit 102 is used to remove oxides and roughen the surface of the board. The automatic placement machine 101 can directly purchase mature equipment from the market (such as The Chinese utility model with the announcement number CN204433783U discloses an automatic board placement device for the horizontal production line of PCB boards); the board grinding unit 102 includes the rough board grinding machine 201 and the fine board grinding machine 202 arranged in sequence. The machine 201 and the fine grinding machine 202 can be directly purchased from the market mature equipment (such as the Chinese utility model of the announcement number CN208811739U disclose...

Embodiment 2

[0101] The present invention also discloses a method for removing scum and smelting copper. Based on the horizontal scumming and smelting copper assembly line described in the first embodiment, the method for scumming and smelting copper sequentially includes the following steps: automatic plate placement, plate grinding Treatment, first washing treatment, first manual appearance inspection, bulky surface treatment, second washing treatment, de-smear surface treatment, third washing treatment, pre-neutralization treatment, fourth washing treatment, re Neutralization treatment, fifth water washing treatment, first drying treatment, manual second appearance inspection, hot water knife dipping treatment, whole hole treatment, sixth water washing treatment, micro etching treatment, seventh water washing treatment , Pre-soaking treatment, activation treatment, eighth water washing treatment, reduction treatment, ninth water washing treatment, copper treatment, tenth water washing tre...

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PUM

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Abstract

The invention relates to a horizontal glue residue removal and copper assembly line. The horizontal glue residue removal and copper assembly line sequentially comprises an automatic plate placement machine, a plate grinding machine group, a first washing groove group, a first operation station, a first surface processing system, a second washing groove group, a second surface processing system, athird washing groove group, a pre-neutralizing groove, a fourth washing groove group, a re-neutralizing groove, a fifth washing groove group, strong air drying equipment, a second operation station, afirst hot water knife immersion groove, a hole shaping machine, a sixth washing groove group, a micro-etching groove, a seventh washing groove group, a pre-immersion groove, a third surface processing system, an eighth washing groove group, a reduction groove, a ninth washing groove group, a fourth surface processing system, a tenth washing groove group, a drying groove group, an automatic platereceiving machine and a transmission mechanism, wherein a plate is driven to rotate by the first surface processing system, the second surface processing system, the third surface processing system and the fourth surface processing system so as to be in contact with a corresponding surface processing liquid. The horizontal glue residue removal and copper assembly line has the effects of relativelyshort length, high processing efficiency and good quality.

Description

Technical field [0001] The invention relates to the technical field of circuit board surface treatment, in particular to a horizontal desmear and copper smelting assembly line and a desmear and copper smelting method. Background technique [0002] Printed PCB boards (circuit boards) are the basic products of modern electronics and information industries. The printed circuit board is based on the pre-designed circuit, and the conductive pattern for the connection between the components is formed on the surface of the board. The manufacturing process has as many as 20 processes. At present, the production process of printed circuit boards includes a series of surface treatment processes for treating the surface of the board, such as: desmearing, electroless copper (copper), nickel plating, tin stripping, nickel, gold, chemical Nickel gold etc. [0003] However, at present, in the steps of desmearing and smelting copper, the plates are usually driven in a horizontal motion. In order...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/26B24B27/00B24B27/033
CPCB24B27/0023B24B27/033H05K3/26
Inventor 饶猛王春锋
Owner SHENZHEN CYPRESS IND DEV CO LTD
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