Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Waste electronic circuit board or electroplating sludge smelting flue gas treatment method

An electronic circuit board, electroplating sludge technology, applied in the field of recycling and processing

Inactive Publication Date: 2019-11-05
河南林兰科技有限公司
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is: according to the deficiencies in the prior art for waste electronic circuit boards and electroplating sludge smelting flue gas treatment technology, the present invention provides an efficient, environmentally friendly and safe waste electronic circuit board or Non-polluting treatment method for electroplating sludge smelting flue gas

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Waste electronic circuit board or electroplating sludge smelting flue gas treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The processing method of waste electronic circuit board smelting flue gas of the present invention, the detailed steps of this processing method are as follows:

[0030] a. First put waste electronic circuit boards into an oxygen-enriched side-blowing smelting furnace for smelting, the smelting temperature is 1300°C, and the smelting time is 8 minutes; after smelting, a metal phase is obtained (the metal phase contains copper, tin, nickel, lead, iron and All precious metals) and soot (the soot contains carbon dioxide, water vapor, hydrogen halide and sulfur, nitrogen oxides, and oxides formed by zinc and some lead), the metal phase enters the smelting system for recycling and reuse; the resulting soot enters the next process;

[0031] b. The dust formed after smelting in step a is introduced into the first-level settling chamber, the second-level settling chamber, the third-level settling chamber, the fourth-level settling chamber, the fifth-level settling chamber and th...

Embodiment 2

[0038] The treatment method of electroplating sludge smelting flue gas of the present invention, the detailed steps of this treatment method are as follows:

[0039] a. First, the electroplating sludge is made into particles of about 50 mm through a granulator, and put into an oxygen-enriched side-blowing smelting furnace for smelting. The smelting temperature is 1300 ° C, and the smelting time is 5 minutes; after smelting, the metal phase (the metal phase contains Copper, tin, nickel, lead, iron and all precious metals) and dust (the dust contains carbon dioxide, water vapor, hydrogen halide and sulfur, nitrogen oxides, and oxides formed by zinc and some lead), and the metal phase enters the smelting system for recycling. Utilization; the resulting smoke enters the next process;

[0040] b. The dust formed after smelting in step a is introduced into the first-level settling chamber, the second-level settling chamber, the third-level settling chamber, the fourth-level settling...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a waste electronic circuit board or electroplating sludge smelting flue gas treatment method. The method comprises the steps of putting waste electronic circuit boards or granulated electroplating sludge into an oxygen-enriched furnace for smelting to obtain a metal phase and smoke dust; settling and purifying the obtained smoke dust through a six-stage settling chamber; radiating and cooling the purified flue gas; after cooling, dedusting again, separating water and gas after dedusting, and then carrying out a plasma cracking oxidation reaction; filling ozone into thecracked flue gas for an oxidation reaction; introducing the oxidized flue gas into a refrigeration cooler for cooling; and introducing the cooled flue gas into an alkaline spray tower for neutralization and oxidation reactions, discharging the generated salt from the bottom of the tower, and discharging the generated gas after standard-reaching separation. The waste electronic circuit board or electroplating sludge smelting flue gas treatment method is efficient, environmentally friendly, safe and free of pollution.

Description

[0001] 1. Technical field: [0002] The invention relates to the technical field of recovery and treatment of waste electronic circuit boards and electroplating sludge, in particular to a treatment method for smelting flue gas of waste electronic circuit boards or electroplating sludge. [0003] 2. Background technology: [0004] As the "final state" of electroplating wastewater after precipitation treatment, electroplating sludge contains heavy metals such as Cu, Ni, Zn, Cr, Fe, etc. The composition is very complex, and heavy metals are difficult to degrade. It has been included in the national hazardous waste list. These heavy metals in electroplating sludge are unstable, easy to accumulate, and easy to lose. If they are not properly treated, they will easily migrate under the influence of the external environment, causing secondary pollution, endangering the environment, and affecting human health. [0005] The main treatment methods of electroplating sludge include harmless...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C22B7/00B01D50/00B01D53/56B01D53/62B01D53/64B01D53/68B01D53/75B01D53/76B01D53/78
CPCC22B7/001B01D53/75B01D53/78B01D53/76B01D53/62B01D53/68B01D53/64B01D53/56B01D2257/504B01D50/20Y02P10/20
Inventor 张松林张静远
Owner 河南林兰科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com