UV-LED curing modified acrylate pressure-sensitive adhesive and preparation method thereof

Abstract

The invention relates to the technical field of pressure-sensitive adhesives, in particular to a UV-LED curing modified acrylate pressure-sensitive adhesive and a preparation method thereof. The pressure-sensitive adhesive comprises the following components in percentage by mass: 20%-60% of acrylate monomer diluent, 1%-4% of photoinitiator and 36%-79% of modified acrylate pressure-sensitive prepolymer, wherein the modified acrylate pressure-sensitive prepolymer is prepared by polymerizing various acrylate monomers terminated by hydrogenated rosin glyceride, hydrogenated rosin glyceride tackifying resin is introduced into a molecular chain of the modified acrylate pressure-sensitive prepolymer to obtain the acrylate pressure-sensitive adhesive with a self-tackifying effect, and the initialadhesion and peel strength of the acrylate pressure-sensitive adhesive are obviously improved; the pressure-sensitive adhesive prepared from the prepolymer has good light aging resistance and high temperature resistance, can be used for preparing an optical pressure-sensitive adhesive with the light transmittance of more than 90%, and satisfies the use requirements of electronic products on the optical pressure-sensitive adhesive. No water or organic solvent participates in the whole production process of the pressure-sensitive adhesive, and the purposes of low energy consumption, safety and environmental protection are achieved.

Description

technical field [0001] The invention belongs to the field of materials, and in particular relates to a UV-LED curing modified acrylate pressure-sensitive adhesive and a preparation method thereof. Background technique [0002] China's pressure-sensitive adhesive market is developing rapidly and is widely used in adhesive tapes, labels, electronic products and other fields. Today's pressure-sensitive adhesive products can be mainly divided into three types: emulsion type, solvent type and hot melt type, especially emulsion type and solvent type pressure sensitive adhesives occupy a dominant position in the market. The solid content of emulsion-type pressure-sensitive adhesive is about 50%, and the drying process after coating film consumes a lot of energy and is time-consuming. Solvent-based pressure-sensitive adhesives have a solid content of 30% to 50%, and a large amount of organic solvents are discharged during the drying process after coating to pollute the environment....

AI Technical Summary

Problems solved by technology

However, in the process of preparing photocurable pressure-sensitive adhesives, if rosin or rosin derivatives (rosin ester or hydrogenated rosin ester (generally dihydrogenated rosin ester), etc.) It is only physical blending, and it is easy to cause incomplete curing, low molecular weight, sticky adhesive layer and low cohesion during light curing.

Because rosin derivatives contain conjugated double bonds or single and double bonds, after the formation of free radicals, due to conjugation or large side group steric hindrance, the free radicals are very stable and weak in activity, and it is difficult to continue to initiate the polymerization of other monomers, resulting in partial polymerization molecular weight. Low, poor performance of cured adhesive layer

[0005] In the patent "CN109810648A A UV-curable non-woven tape and its preparation method", the tackifying resin (which is any one or at least two mixtures of hydrogenated rosin glyceride, hydrogenated hydrocarbon resin and hydrogenated rosin methyl ester) ) is directly added to the acrylate oligomer in the form of physical blending, and mixed with a crosslinking agent and a photoinitiator to prepare a UV-curable polyacrylate pressure-sensitive adhesive. This method is a well-known pressure-sensitive adhesive preparation in the industry. One of the methods, but there are the following obvious disadvantages: Due to the limited compatibility of acrylate oligomers and tackifying resins, there are very few types of tackifying resins that are actually available and must be carefully selected; more importantly, many tackifying resins The addition of resin will hinder the radiation curing of pressure-sensitive adhesives to varying degrees. For example, unsaturated rosin and styrene-based tackifying resins, due to the easy transfer of the α-position hydrogen atom of the double bond in the molecular structure, will cause radiation curing. free radical chains, thereby preventing radiation polymerization of reactive monomers and telechelic oligomers

However, the existing pressure-sensitive adhesive preparation technology still has some of the above-mentioned shortcomings and places that still need to be improved in the process of preparing light-cured pressure-sensitive adhesive. Therefore, the present invention proposes some new ideas for innovation and obtains corresponding feasible technical solutions.

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