A kind of organic silver/carbon nanotube composite slurry and its preparation method and application

A carbon nanotube composite and carbon nanotube technology, which is applied in nanotechnology, nanotechnology, cable/conductor manufacturing, etc., can solve the problems of resin aging and falling off, high resistivity, etc., and achieve high bonding strength, low resistivity, The effect of fast and efficient preparation

Active Publication Date: 2020-07-17
ZHEJIANG ZHENYOU ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems in the prior art that the resin is easy to age and fall off when the printed circuit board is perforated with conventional silver paste and resin, and the resistivity is relatively large when the conventional organic silver paste is used for perforation, the present invention provides an organic Silver / carbon nanotube composite slurry and its preparation method and application

Method used

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  • A kind of organic silver/carbon nanotube composite slurry and its preparation method and application
  • A kind of organic silver/carbon nanotube composite slurry and its preparation method and application
  • A kind of organic silver/carbon nanotube composite slurry and its preparation method and application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Preparation of organic silver / carbon nanotube composite slurry:

[0056] 1) Preparation of materials: Prepare carboxylated carbon nanotubes, silver acetate, ethylamine and ethylene glycol according to the mass ratio of 15:12:20:53;

[0057] 2) Mix ethylamine and ethylene glycol to form an organic solution, add silver acetate as a silver source to the organic solution, and form a precursor fluid containing silver acetate-ethylamine complex after ultrasonic vibration for 40 minutes;

[0058] 3) Add carboxylated carbon nanotubes to the precursor body fluid, and mechanically stir for 8 hours after ultrasonic vibration for 60 minutes to obtain organic silver / carbon nanotube composite slurry;

[0059] Preparation of nano conductive composite film:

[0060] Add the prepared organic silver / carbon nanotube composite slurry dropwise into the guide hole of the printed circuit board, heat it at 120°C for 40min, and directly in-situ deposit nano-silver and carbon nanotube on the in...

Embodiment 2

[0066] Preparation of organic silver / carbon nanotube composite slurry:

[0067] 1) Preparation of materials: prepare carboxylated carbon nanotubes, silver acetate, ethylamine and ethylene glycol according to the mass ratio of 20:15:25:40;

[0068] 2) Mix ethylamine and ethylene glycol to form an organic solution, add silver acetate as a silver source to the organic solution, and form a precursor fluid containing silver acetate-ethylamine complex after ultrasonic vibration for 40 minutes;

[0069] 3) Add carboxylated carbon nanotubes to the precursor body fluid, and mechanically stir for 8 hours after ultrasonic vibration for 60 minutes to obtain organic silver / carbon nanotube composite slurry;

[0070] Preparation of nano conductive composite film:

[0071] Add the prepared organic silver / carbon nanotube composite slurry dropwise into the guide hole of the printed circuit board, heat at 150°C for 60 minutes, and directly deposit nano-silver and carbon nanotubes on the inner w...

Embodiment 3

[0077] Preparation of organic silver / carbon nanotube composite slurry:

[0078] 1) Preparation of materials: prepare carboxylated carbon nanotubes, silver acetate, ethylamine and ethylene glycol according to the mass ratio of 18:15:22:45;

[0079] 2) Mix ethylamine and ethylene glycol to form an organic solution, add silver acetate as a silver source to the organic solution, and form a precursor fluid containing silver acetate-ethylamine complex after ultrasonic vibration for 40 minutes;

[0080] 3) Add carboxylated carbon nanotubes to the precursor body fluid, and mechanically stir for 8 hours after ultrasonic vibration for 60 minutes to obtain organic silver / carbon nanotube composite slurry;

[0081] Preparation of nano conductive composite film:

[0082] Add the prepared organic silver / carbon nanotube composite slurry dropwise into the guide hole of the printed circuit board, heat at 130°C for 50 minutes, and directly deposit nano-silver and carbon nanotubes on the inner w...

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Abstract

The invention relates to the technical field of electronic paste, in particular to organic silver / carbon nano tube composite paste and a preparation method and application thereof. The organic silver / carbon nano tube composite paste is organic composite paste consisting of an organic solvent, a carbon nano tube, a silver compound and ethylamine; the silver compound and ethylamine in the organic silver / carbon nano tube composite paste form an organic silver complex. The composite paste is convenient to prepare, and can be quickly and efficiently prepared by adopting a two-step method; the prepared composite paste has the advantages of convenient transportation and storage; the composite paste is used for perforating through holes on a printed circuit board, and the nano conductive compositefilm layer formed on the inner walls of the holes have the advantages of the high bonding strength, the low resistivity and the like.

Description

technical field [0001] The invention relates to the technical field of electronic paste, in particular to an organic silver / carbon nanotube composite paste and its preparation method and application. Background technique [0002] As electronic equipment gradually tends to be miniaturized and portable, printed circuit boards are developing towards high precision, thinner lines, high-density assembly and environmental protection. In addition, the price boundaries and profits of electronic equipment are gradually shrinking. In this context, a new technology of silver paste through hole was born. This silver conductive paste mainly uses micron-sized silver powder as the conductive medium, and a special resin curing agent as the main binder, adding a small amount of diluent, using the silver paste in the hole to shrink toward the hole wall when heated, and conduct the upper and lower layers. However, this physical coating method has problems such as the aging of the resin binde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/24H01B5/14H01B13/00H05K1/09B82Y30/00
CPCB82Y30/00H01B1/24H01B5/14H01B13/00H05K1/092
Inventor 詹有根青榆李海成潘青占炎亮徐斌
Owner ZHEJIANG ZHENYOU ELECTRONICS CO LTD
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