Treatment solution for copper residue on surface of dart fixture
A treatment liquid and fixture technology, which is applied in the field of metal surface treatment, can solve the problems of health hazards for operators, unstable properties of concentrated nitric acid, and easy volatility, etc., to improve reaction stability, increase the amount of dissolved copper in the solution, and improve the surface active effect
Active Publication Date: 2019-10-25
深圳市航盛电路科技股份有限公司
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, the nature of concentrated nitric acid is not stable enough, and it is easy to volatilize nitrogen dioxide, and concentrated nitric acid will also generate nitrogen dioxide in the process of reacting with metal copper. Nitrogen dioxide is a brown-red toxic gas with strong irritation.
Therefore, this method is extremely harmful to the health of operators.
Method used
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Embodiment 1
[0026] Embodiment 1, a copper treatment solution attached to the surface of a flying target fixture, includes the following components.
[0027]
Embodiment 2
[0028] Embodiment 2, a copper treatment solution attached to the surface of a flying target fixture, includes the following components.
[0029]
Embodiment 3
[0030] Embodiment 3, a copper treatment solution attached to the surface of a flying target fixture, includes the following components.
[0031]
[0032]
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Abstract
The invention relates to a treatment solution for copper residue on the surface of a dart fixture. The treatment solution comprises, by weight, 50-65 parts of sulfuric acid solution, 8-12 parts of hydrogen peroxide solution, 8-12 parts of stabilizer, 10-15 parts of citric acid solution, 4-8 parts of sodium citrate powder and 3-6 parts of sodium dodecyl benzene sulfonate or urotropine; the stabilizer at least includes, by weight, 75-85 parts of deionized water, 3-6 parts of ethanol solution and 2-5 parts of sulfonic compound. The treatment solution has the effect that the volatility of the treatment solution is reduced to prevent the treatment solution from harming the physical health of an operator.
Description
technical field [0001] The invention relates to the technical field of metal surface treatment, in particular to a copper treatment solution for attaching copper to the surface of a flying target fixture. Background technique [0002] PCB circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components. Copper electroplating is usually required when preparing PCB boards in industry. Copper is used to interconnect components on PCB boards and is a good conductor material for forming PCB conductive path board surface graphics. In the process of PCB board electroplating, it is usually necessary to use a dart fixture to clamp the PCB board. Since the end of the dart fixture is often soaked in the electroplating solution, the surface of the dart fixture is easy to attach metal copper to form a layer of copper attachment surface. When the dart fixture clamps the next unplated PCB board, the attached copper on its surface is eas...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18C25D21/00H05K3/18
CPCC23F1/18C25D21/00H05K3/188
Inventor 肖锦鸿庄展鹏李党党
Owner 深圳市航盛电路科技股份有限公司
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