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Microencapsulation modification method of laser direct structuring additive, product and application thereof

A technology of laser direct structuring and microencapsulation, which is used in the preparation of laser direct structuring materials and the microencapsulation modification of laser direct structuring additives. problem, to achieve the effect of improving thermal stability and enhancing compatibility

Inactive Publication Date: 2019-09-27
无锡赢同新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Taking the polycarbonate system as an example, free metal ions or atoms are the catalysts that catalyze the degradation of the resin; at the same time, inorganic metal compounds or organic metal mixtures are alkaline to varying degrees, which will further aggravate the degradation reaction of polycarbonate composites degree, so that the material loses its practical value

Method used

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  • Microencapsulation modification method of laser direct structuring additive, product and application thereof
  • Microencapsulation modification method of laser direct structuring additive, product and application thereof
  • Microencapsulation modification method of laser direct structuring additive, product and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0043] Preparation of melamine prepolymer: Add melamine and formaldehyde at a molar ratio of 1:3 to a three-necked flask, stir to dissolve melamine in aqueous formaldehyde (concentration of aqueous formaldehyde is 37%), and use 10% Na 2 CO 3 Adjust the pH value of the system to 8-9, and keep the reaction at 80°C for 1.5h to prepare the melamine prepolymer;

[0044] Preparation of microcapsules: Add an appropriate amount of distilled water and a certain amount of copper chromium oxide into a three-necked flask, add an appropriate amount of melamine prepolymer after rapid stirring, and keep the ratio of copper chromium oxide and melamine prepolymer at 1 / 1 , use 10% HAc to adjust the pH value of the system to 5-6, then stir at the set speed, slowly raise the temperature to 75 ° C, keep warm for 2 hours, take it out, put it in an ice-water bath to cool to room temperature, and use 10% Na 2 CO 3 Adjust the pH to neutral, filter, wash, and vacuum-dry to obtain microcapsule sample...

Embodiment 1

[0047] In embodiment 1, raw material total amount is 6kg, and by weight percentage, component is as follows:

[0048] Component % by weight, % polycarbonate 91 Modified LDS additive 3 Toughener 5 other additives 1

Embodiment 2

[0049] In embodiment 2, raw material total amount is 5.5kg, and by weight percentage, component is as follows:

[0050] Component % by weight, % polycarbonate 89 Modified LDS additive 5 Toughener 5 other additives 1

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Abstract

The invention discloses a microencapsulation modification method of a laser direct structuring additive, a product and application thereof. The method comprises preparation of a melamine prepolymer and a microcapsule. The surface properties of the laser direct structuring additive is modified by microencapsulation. Thereby, compatibility between the laser direct structuring additive and matrix resin is enhanced, heat stability of a composite material is improved, and a laser direct structuring material with excellent comprehensive performance is finally obtained. The laser direct structuring material obtained by the method shows excellent heat stability and high toughness during processing, and use performance of the product is significantly improved.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a microencapsulation modification method of laser direct structuring additives, a product, preparation and application of corresponding laser direct structuring materials. Background technique [0002] LDS, or Laser Direct Structuring, is a 3D-MID production technology with professional laser processing, injection and electroplating processes. Its principle is to endow ordinary plastic components / circuit boards with electrical interconnection functions, support component functions and plastic shells Support, protection and other functions, as well as the shielding and antenna functions produced by the combination of mechanical entities and conductive graphics, are suitable for the production of local thin lines. [0003] LDS can avoid environmental pollution and water consumption caused by traditional plastic electroplating process to a large extent, and simplify the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K3/22C08L69/00C08L51/04
CPCC08K3/22C08K9/10C08L69/00C08L2201/08C08L51/04
Inventor 吴彤李莹
Owner 无锡赢同新材料科技有限公司
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