Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and manufacturing method of medium-high-density board

A high-density board and manufacturing method technology, applied in the field of wood processing, can solve the problems of inability to meet the needs of deep veneer processing, restrict application fields, and high surface hardness, and achieve the effects of increasing strength, expanding application fields, and improving surface hardness

Active Publication Date: 2019-09-27
BEIJING FORESTRY UNIVERSITY +2
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In actual production, due to the high hardness of the surface of the single MDI adhesive base material, it is only suitable for beautiful surfaces when pressing the floor. The phenomenon of whitening on the surface cannot meet the processing requirements of deep finishes, which restricts its application field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and manufacturing method of medium-high-density board
  • Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and manufacturing method of medium-high-density board
  • Formaldehyde-free medium-high-density board capable of meeting deep facing requirements and manufacturing method of medium-high-density board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0038] The preparation method of lignin glue is as follows: first use sodium hydroxide solution to dissolve lignin, reduce the viscosity of lignin lye by adding urea, then add melamine and then undergo a certain degree of polycondensation reaction with lignin at high temperature, and finally add the dissolved Polyvinyl alcohol aqueous solution can improve the initial viscosity of lignin glue.

[0039] The lignin glue of the embodiment of the present invention utilizes sodium hydroxide alkaline condition to dissolve lignin, polyvinyl alcohol improves the initial viscosity, urea reduces the viscosity of lignin, and melamine promotes the self-gluing of lignin under the action of high temperature to play the role of glue The effect of the agent. Formaldehyde is not added in the preparation process, and the product is aldehyde-free, and the lignin self-glued during high-temperature curing has high bonding strength and good water resistance.

[0040] As a preferred embodiment, the ...

Embodiment 1

[0058] A method for manufacturing formaldehyde-free deep-decorated medium and high-density boards, specifically comprising the following steps:

[0059] (1) wood chipping: wood raw material eucalyptus is chipped into wood chips that meet the production scale;

[0060] (2) Timber screening: screen the chipped wood chips, remove the debris, and separate the oversized wood chips for further crushing;

[0061] (3) Cooking and softening: After screening, wood chips of moderate size are softened by cooking, the cooking pressure is 0.85MPa, and the cooking time is 3.5min;

[0062] (4) Fiber separation: put the wood chips into the thermal grinder, mechanically separate the fibers, the thermal grinding temperature is 157 ° C, and the pressure is 0.8 MPa;

[0063] (5) One-time sizing: one-time sizing of fibers, the glue applied is lignin glue, and the amount of sizing is 68kg / m 3 , the lignin glue used is self-made lignin glue, and its composition is lignin, sodium hydroxide, melamine...

Embodiment 2

[0074] A method for manufacturing formaldehyde-free deep-decorated medium and high-density boards, specifically comprising the following steps:

[0075] (1) Wood shavings: the wood raw material poplar is cut into wood chips that meet the production scale;

[0076] (2) Timber screening: screen the chipped wood chips, remove the debris, and separate the oversized wood chips for further crushing;

[0077](3) Cooking and softening: After screening, wood chips of moderate size are softened by cooking, the cooking pressure is 0.81MPa, and the cooking time is 4.0min;

[0078] (4) Fiber separation: put the wood chips into the thermal grinder, mechanically separate the fibers, the thermal grinding temperature is 156°C, and the pressure is 0.84MPa;

[0079] (5) One-time sizing: one-time sizing of fibers, the glue applied is lignin glue, and the amount of sizing is 79kg / m 3 , the lignin glue used is self-made lignin glue, its composition is lignin, sodium hydroxide, melamine, polyvinyl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a formaldehyde-free medium-high-density board capable of meeting deep facing requirements and a manufacturing method of the medium-high-density board. The medium-high-density board comprises the following steps of wood chipping, screening, cooking and softening, fiber separating, gluing, drying and sorting, paving, pre-pressing, hot pressing, cooling, sanding, and inspection and warehousing. The gluing comprises two steps of gluing, and specifically comprises the steps of carrying out primary gluing by using lignin glue, carrying out waterproof treatment, and then carrying out secondary gluing by using MDI glue. According to the manufacturing method, a biomass adhesive and a formaldehyde-free adhesive are adopted, a curing agent, an anti-mildew agent and the like are not added, by virtue of a two-time gluing method, formaldehyde pollution is completely eradicated from a source, and formaldehyde-free production and formaldehyde-free products are realized; and the gluing process is controlled in sequence and glue types and proportion are controlled, so that the surface hardness of the products can be improved, and the final products can be subjected to deep facing so as to achieve 2-8 millimeters.

Description

technical field [0001] The invention relates to the field of wood processing, in particular to a formaldehyde-free deep-decorated medium-high-density board and a manufacturing method thereof. Background technique [0002] With social development and changes in people's lifestyles and the purpose of protecting forestry resources, medium and high density boards have developed rapidly at home and abroad as a substitute for log furniture panels, and are widely used in furniture, interior decoration and packaging materials. However, due to the use of formaldehyde-based adhesives in the production process, the problem of formaldehyde pollution cannot be ignored. Formaldehyde has become one of the main pollution sources recognized by the density board industry, and after entering the family, the free formaldehyde in the density board is still continuously released. With the continuous improvement of people's attention to the environmental protection of building materials and the i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B27N1/00B27N1/02B27N3/00B27N3/12B27N3/18C08L97/00C08L29/06C08K5/3492C08K5/21
CPCB27N3/12B27N1/0209B27N1/00B27N3/18B27N3/002C08L97/005C08L29/06C08K5/34922C08K5/21C09J175/04C08G18/7671C08G18/302C09J197/005B27N1/003B27N3/04B27N7/00C08K3/22
Inventor 孙润仓袁同琦陈晓龙王素鹏陈月英周贤鹏
Owner BEIJING FORESTRY UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products