Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip control method, device and equipment and medium

A chip control, chip technology, applied in the field of chip protection

Inactive Publication Date: 2019-09-24
BEIJING TRICOLOR TECH
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the purpose of this application is to provide a chip control method, device, equipment and medium to solve the problem of how to increase the cooling speed of the chip in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip control method, device and equipment and medium
  • Chip control method, device and equipment and medium
  • Chip control method, device and equipment and medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only It is a part of the embodiments of this application, not all of them. The components of the embodiments of the application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chip control method, device and equipment and a medium. The method comprises the following steps: when a chip is in a clock frequency regulation and control state, reducing the value of an output current of a signal output pin of the chip until the current value of the output current of the signal output pin of the chip is reduced to a preset current value if the temperature of the chip is greater than a preset temperature value and the current value of the output current of the signal output pin of the chip is greater than the preset current value; enabling the chip to be in a low-power-consumption operation state during subsequent operation; wherein, in the low-power-consumption operation state, the current value of the output current of the signal output pin of the chip is kept at the preset current value; and in the low-power-consumption operation state, when the temperature of the chip is greater than the preset temperature value, a secondary function module is turned off according to the function classification of each module of the chip, so that the chip is kept in an advanced control state.

Description

technical field [0001] The present application relates to the field of chip protection, in particular to a chip control method, device, equipment and medium. Background technique [0002] The society is constantly progressing, and the playback and transmission of videos have also emerged as the times require. The chip is used to control the transmission and playback of video. In the process of continuous updating of the chip, the operating frequency, integration, and complexity of the chip continue to increase, and the hardware design tends to be miniaturized, and the power consumption of the chip continues to increase. , The increase in power consumption causes the temperature of the chip to rise and shorten the life of the chip. When the temperature of the chip exceeds the maximum allowable temperature of the chip, it will cause damage to the device where the chip is located. [0003] In order to prevent the chip temperature from being too high and damage the equipment, i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G05D23/20
CPCG05D23/20
Inventor 孔令术
Owner BEIJING TRICOLOR TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com