Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of flexible transparent conductive film

A flexible and transparent substrate technology, applied in the direction of equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, conductive layers on insulating carriers, etc., can solve the problem of poor stability of flexible transparent conductive films, easy holes or Disconnection, low yield and other problems, to achieve the effect of good light transmission and stability, smooth surface, and increase yield

Inactive Publication Date: 2019-09-20
SHENZHEN TECH UNIV
View PDF6 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for preparing a flexible transparent conductive film in view of the above-mentioned defects of the prior art, which overcomes the fact that the existing flexible transparent conductive film is prone to holes or broken lines, resulting in poor stability of the flexible transparent conductive film , The problem of low yield

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of flexible transparent conductive film
  • Preparation method of flexible transparent conductive film
  • Preparation method of flexible transparent conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Now in conjunction with the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0040] Such as figure 1 and Figure 5 As shown, the present invention provides a preferred embodiment of a method for preparing a flexible transparent conductive film.

[0041] A method for preparing a flexible transparent conductive film, comprising the steps of:

[0042] S10, apply a layer of embossing glue 20 on the end surface of the flexible transparent substrate 10;

[0043] S20, embossing micro-nano columnar array graphics on the embossing glue 20;

[0044] S30, removing the embossing glue 20 between the two columns to expose the flexible transparent substrate 10;

[0045] S40, depositing a layer of metal film 30 on the flexible transparent substrate 10 and the embossing glue 20;

[0046] S50 , removing the embossing glue 20 on the flexible transparent substrate 10 and the metal film 30 on the upper surface of the embossing glu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of conductive materials, and specifically relates to a preparation method of a flexible transparent conductive film. The preparation method includes the steps of applying a layer of imprinting glue to the end face of a flexible transparent substrate; imprinting a micro-nano cylindrical array pattern on the imprinting glue; removing the imprinting glue between two cylinders to expose the flexible transparent substrate; depositing a metal film on the flexible transparent substrate and the imprinting glue; removing the imprinting glue on the flexible transparent substrate and the metal film on the imprinting glue to obtain a transparent conductive network. According to the invention, the flexible transparent conductive film is prepared by means of combining nano imprinting and film coating, the problem of wire breakage existing in the conductive film prepared according to the traditional nano-imprinting assisted method of filling nano-imprinting grooves by scrape coating metal conductive paste is overcome, the conductivity of the flexible transparent conductive film is improved, and the prepared flexible transparent conductive film is better in stability and high in finished product rate.

Description

technical field [0001] The invention relates to the technical field of conductive materials, in particular to a preparation method of a flexible transparent conductive film. Background technique [0002] Transparent conductive film (ITO) is a film that is both transparent and conductive. Because of its high transmittance and high conductivity in the visible light range, it has been used in the fields of light-emitting devices, photovoltaic devices, optical waveguides, sensors, flat-panel liquid crystal displays, electrochromic windows, electromagnetic shielding and anti-static films. widely used. With the development of science and technology, more and more electronic devices begin to develop in the direction of flexibility and ultra-thinness, which makes the demand for flexible transparent conductive films increasingly urgent. Flexible transparent conductive film not only has the photoelectric characteristics of glass substrate transparent conductive film, but also has ma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B13/00B82Y40/00
CPCB82Y40/00H01B5/14H01B13/0026
Inventor 仇明侠陈业旺王秋霞王宁胡路峰韩培刚苏耀荣
Owner SHENZHEN TECH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products