Copper foil resistor and circuit board structure having the same

Abstract

The present invention discloses a copper foil resistor and a circuit board structure having the same. The copper foil resistor mainly adopts nickel, chromium, tungsten, a nickel metal compound, a chromium metal compound, a tungsten metal compound, a nickel based alloy, a chromium based alloy or a tungsten based alloy as a resistive layer, the resistive layer and a copper foil co-constitute the copper foil resistor, and the copper foil resistor is adapted to be combined with a substrate to form the circuit board structure. It is worth noting that a sputtered alloy, metal or metal compound resistive layer has better plating density and continuity, so that the minimum surface resistance can be less than or equal to 5 ohms / port. At the same time, alloy, metal or metal compound resistive films made by sputtering technology can also effectively reduce the production of industrial wastewater. More importantly, in order to fabricate a resistor assembly required for an electronic circuit on the circuit board structure including the copper foil resistor, it is only necessary to perform two times of etching on the circuit board structure.

Description

technical field [0001] The invention relates to the technical field of thin film resistors, in particular to an embedded copper foil resistor and a circuit board structure with the embedded copper foil resistor. Background technique [0002] Engineers with electronic, electrical or labor backgrounds should have purchased printed circuit boards (PCBs) by themselves, and after developing, etching, and stripping (DES) the printed circuit boards based on a pre-designed circuit pattern, A patterned copper foil circuit, called an electronic circuit, can be produced on the surface of the printed circuit board. After completing the fabrication of the electronic circuit, the predetermined chips and passive components, such as amplifiers, processors, resistors, capacitors, inductors, etc., are arranged on the electronic circuit. [0003] On the other hand, with the high development of smart technology, lightness and thinness have become the basic specification requirements of portabl...

AI Technical Summary

Problems solved by technology

Simply put, the value of the surface resistance of this embedded thin film resistor cannot be lower than 10 ohms

[0010] (3) Use the bending test machine to measure the diameter of the circular shaft In the process of completing the bending test of the copper foil resistor 17, it was found that after the copper foil resistor 17 was bent more than 40 times, the peeling phenomenon began to appear between the copper foil 15 and the resistance layer 16, indicating that the copper foil 15 and the nickel The adhesion between the resistive layers 16 made of phosphorus compounds still needs to be improved

[0012] (5) Because the plating density and continuity of the copper foil resistor 17 are not perfect, after the electronic circuit is produced on the copper foil resistor substrate 18 by developing and etching technology, the line width / line spacing of the electronic circuit is usually greater than 30 micron / 30 micron

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