Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for repairing cultivation soil by using semi-matrix covering

A repair method and covering technology, applied in planting substrates, botanical equipment and methods, soil preparation methods, etc., can solve the problems of increased plant dead seedling rate, decreased plant fruit quality, and weakened plant growth, etc., to achieve easy screening , high yield and abundant metabolites

Inactive Publication Date: 2019-08-30
海口路氏肥业有限公司
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The same substrate plants have been planted continuously for more than 2 years, and soil diseases and insect pests will become serious year by year, especially soil diseases such as powdery mildew and gray mold, as well as the most serious pests such as spider mites, aphids and nematodes, Fusarium, Phytophthora, etc. The growth becomes weaker year by year, the dead seedling rate of the plant increases year by year, the fruit quality of the plant decreases year by year, and the output decreases year by year

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for repairing cultivation soil by using semi-matrix covering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The following is further described in detail through specific implementation methods:

[0033] The embodiment is basically as attached figure 1 Shown: A method of repairing cultivated soil with semi-matrix covering, this repair method includes soil replacement method, chemical improvement method, bioremediation method and germination test to carry out deep repair and rectification of the soil.

[0034] In the soil replacement method, the operator first turns over, air-dries, grinds and filters the soil at a depth of 20-30 cm from the surface of the cultivation tank, and then the operator excavates the planting pit of the original cultivation tank into a trapezoidal cross-section. Sometimes the soil mixed with harmful substances is turned up, and the deep soil is exposed.

[0035] The operator then air-dries the dug out soil to make the soil dry into pieces for easy screening. The operator scoops up the dried soil with a moisture content of 15% and puts it into a 55-mes...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for repairing cultivation soil by using a semi-matrix covering, and belongs to the field of agricultural planting. The method comprises the following steps that S1, surface soil of a cultivation tank is pretreated, wherein the soil 20-30 cm away from the ground is turned to obtain the pre-treated surface soil; S2, deep treatment of the surface soil is conducted, wherein a disinfectant is added to the filtered surface soil; S3, the cultivation tank is repaired and maintained, and the deep-treated surface soil is placed into the cultivation tank; S4, the semi-matrix covering is added, wherein the semi-matrix covering covers the surface of the cultivation tank; S5, data counting is performed, and repaired nutrient soil is obtained when the parameters of a germination test plant meet the normal plant standards. Through disinfectant application (a chemical modifier method), soil deep ploughing (a soil replacement method) and semi-matrix covering (a bioremediation method), multi-layer soil repairing is conducted, cultivation semi-soil semi-matrix repairing is conducted, the occurrence of disease and pest damage is reduced, the dead rate of plants is reduced and accordingly the annual yield is improved.

Description

technical field [0001] The invention belongs to the field of agricultural planting, in particular to a method for repairing cultivation soil with a semi-matrix covering. Background technique [0002] In recent years, with the improvement of agricultural productivity, vegetable substrate cultivation technology is gradually being recognized by vegetable and fruit farmers for its advantages of saving labor and labor, saving water and fertilizer, high quality and high efficiency, environmental protection and less pollution, and avoiding continuous cropping obstacles. Substrate cultivation technology refers to a cultivation method in which a solid substrate (medium) is used to fix the plant root system and absorb nutrient solution and oxygen through the substrate. The innovation of semi-substrate cultivation technology is to cultivate plants with half substrate and half soil. The cultivation groove is trapezoidal. When filling the soil, fill the soil into a triangle, occupying h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): A01B79/02A01G24/20A01G13/02A61L2/23A61L101/02
CPCA01B79/02A01G24/20A01G13/0262A61L2/23
Inventor 路永强郑德助包宇飞单义翔劳威范荣昌李鑫路云然
Owner 海口路氏肥业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com