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Low-temperature cold-conducting tin ball

A low-temperature freezing and solder ball technology, which is applied in packaging, transportation and packaging, and individual objects, can solve the problems of easy deterioration of the surface, easy oxidation of solder balls, and blackening of the surface of solder balls, so as to achieve good electroplating effect and prevent Modification and oxidation, the effect of reducing impurities

Inactive Publication Date: 2019-08-27
SUZHOU BAIDANENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Solder balls are used as solder in soldering work, and solder balls are suitable for electroplating production in PCB factories. Existing low-temperature conductive solder balls for soldering tend to make the coating brittle and produce pinholes due to excessive impurities when used, and at the same time Conductive cooling solder balls are prone to oxidation, and the surface is prone to deterioration, etc., resulting in blackening of the surface of the solder balls and streaks. For this reason, we propose a low-temperature conductive cooling solder ball

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A low-temperature cooling-conducting tin ball, the manufacturing method of the low-temperature cooling-conducting tin ball comprises the following steps:

[0024] a: Material selection: bismuth, tin, antimony, copper, zinc, iron, aluminum, silver, nickel and gallium, the composition ratio of the above raw materials is: bismuth: 90%, tin: 1.34%, antimony: 1.01%, copper: 1.05%, Zinc: 1.01%, Iron: 1.04%, Aluminum: 1.01%, Silver: 1.05%, Nickel: 1.01%, Gallium: 1.48%;

[0025] b: low temperature freezing: the cooling liquid in step a is subjected to low temperature freezing, and the cooling time is: 15min;

[0026] c: liquid preparation: take out the raw material in step b and put it into the high-temperature reaction kettle for high-temperature heating, through low-temperature-high temperature, and auxiliary stirring is carried out by a stirring device during heating, so that the metal in the raw material is in a molten state to form an alloy liquid;

[0027] d: Slag remov...

Embodiment 2

[0040] A low-temperature cooling-conducting tin ball, the manufacturing method of the low-temperature cooling-conducting tin ball comprises the following steps:

[0041] a: Material selection: bismuth, tin, antimony, copper, zinc, iron, aluminum, silver, nickel and gallium, the composition ratio of the above raw materials is: bismuth: 99%, tin: 0.4%, antimony: 0.02%, copper: 0.07%, Zinc: 0.02%, Iron: 0.06%, Aluminum: 0.02%, Silver: 0.07%, Nickel: 0.02%, Gallium: 0.32%;

[0042] b: low temperature freezing: the cooling liquid in step a is subjected to low temperature freezing, and the cooling time is: 20min;

[0043] c: liquid preparation: take out the raw material in step b and put it into the high-temperature reaction kettle for high-temperature heating, through low-temperature-high temperature, and auxiliary stirring is carried out by a stirring device during heating, so that the metal in the raw material is in a molten state to form an alloy liquid;

[0044] d: Slag remova...

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PUM

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Abstract

The invention discloses a low-temperature cold-conducting tin ball in the technical field of tin balls. A manufacturing method of the low-temperature cold-conducting tin ball comprises the following steps of a, selecting materials; b, freezing at a low temperature; c, liquid preparing; d, residue removing; e, manufacturing; f, primary cleaning; g, film coating; h, secondary cleaning; i, packagingoperation; and j, post-packaging operation. The tin ball prepared through the method has relatively strong corrosion resistance, meanwhile, the lead content is low, the electroplating effect is excellent in the using process, the cost is saved, the consumption is reduced, molten alloy is subjected to slag removal and gas removal treatment to be made into tin balls, the impurity content of the tinballs is reduced, and two cleaning processes are adopted for cleaning, so that impurities are further reduced; meanwhile, the tin balls are subjected to oxidation coating in an inert gas environment,so that the surfaces of the tin balls are effectively protected, the tin balls are prevented from deteriorating and oxidizing, meanwhile, a release film is arranged during packaging, the release filmcan further protect the tin balls, so that the tin balls can be isolated from external air, the tin balls are prevented from deteriorating and oxidizing, and the service life is prolonged.

Description

technical field [0001] The invention relates to the technical field of tin balls, in particular to a low-temperature cooling-conducting tin ball. Background technique [0002] The solder balls act as solder in the soldering work, and the solder balls are suitable for the electroplating production of PCB factories. The existing low-temperature cooling solder balls for soldering are easy to make the coating brittle due to excessive impurities, resulting in pinholes and low temperature. The cooling-conducting tin ball is prone to oxidation, and the surface is prone to deterioration, etc., resulting in blackening of the surface of the tin ball and streaks. For this reason, we propose a low-temperature cooling-conducting tin ball. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a low-temperature cooling-conducting tin ball to solve the above-mentioned problems in the background art. [0004] In order to achieve the above purpose, the presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30C22C12/00C22C1/02C22C1/06B65B63/00B65B5/00
CPCB65B5/00B65B63/005C22C1/02C22C1/06C22C12/00C25D3/30
Inventor 扶兰兰
Owner SUZHOU BAIDANENG ELECTRONICS
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