Sealing agent and its preparation method and application

A technology of sealing agent and solvent, which is applied in the fields of printed circuit manufacturing, liquid chemical plating, and coating of non-metallic protective layers, etc., which can solve the problems of Giavani effect, unsatisfactory Giavani effect, PCB Eliminate metal reactivity, avoid Giavani effect, and improve corrosion resistance and anti-corrosion performance

Inactive Publication Date: 2020-06-02
ZHUHAI CHINA EAGLE ELECTRONIC CIRCTCUIS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, provide a kind of sealing agent and its preparation method, to solve the existing technical problem of solving the unsatisfactory Giavani effect and easily lead to the scrapping of PCB boards
[0006] Another object of the present invention is to provide a method for anti-corrosion treatment of gold plate to solve the technical problem that the existing gold plate is prone to Giavani effect

Method used

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  • Sealing agent and its preparation method and application
  • Sealing agent and its preparation method and application
  • Sealing agent and its preparation method and application

Examples

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preparation example Construction

[0036] On the basis of the sealing agent described above, the embodiment of the present invention also provides a preparation method of the sealing agent. The preparation method flow process of the sealing agent is as follows figure 1 shown, including the following steps:

[0037] S01: Adding the corrosion inhibitor into the solvent for mixed treatment to obtain the first mixed solution;

[0038] S02: adding a builder to the first mixed liquid for mixing treatment to obtain a second mixed liquid;

[0039] S03: adding a pH regulator and a chelating agent to the second mixed solution for mixing treatment to obtain a third mixed solution;

[0040] S04: adding a surfactant to the third mixed solution for mixing treatment.

[0041] Wherein, in the step S01, in order to effectively dissolve the corrosion inhibitor in the solvent, in one embodiment, the solvent may be heat-treated to improve the solubility of the corrosion inhibitor. Such as heating the solvent to above 60°C.

...

Embodiment 11

[0053] This embodiment provides a sealing agent composition. The sealant composition comprises the following components:

[0054]

[0055] The sealing agent composition described in this embodiment is prepared according to the following steps:

[0056] S11: Add 10 liters of pure water and 5 liters of polyethylene glycol 200 to the container, and raise the temperature to not lower than 60 degrees;

[0057] S12: Add 7.5 liters of OP-10 emulsifier, stir to dissolve;

[0058] S13: Add 800 grams of stearyl mercaptan and 80 grams of cetyl mercaptan, and heat to dissolve;

[0059] S14: Add nickel acetate NiAC2.4H 2 O content 500g;

[0060] S15: add sodium fluoride NaF content 120g;

[0061] S16: replenish water and stir evenly, pack after cooling.

Embodiment 12

[0063] This embodiment provides a sealing agent composition. The sealant composition comprises the following components:

[0064]

[0065] Wherein, the surfactant includes nickel acetate and sodium fluoride, and the mass ratio of nickel acetate and sodium fluoride is 1:1.

[0066] The preparation method of the sealing agent composition described in Example 12 is to prepare according to the preparation method in Example 11 according to the formula of this example.

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Abstract

The invention discloses a hole sealing agent and a preparation method and application thereof. The hole sealing agent disclosed by the invention comprises a solvent and further comprises the followingcomponents in concentration: 0.1-0.3L / L of a corrosion inhibitor, 30-40g / L of a pH regulator, 2-5g / L of a chelating agent, 0.15-0.5g / L of a builder, and 5-30g / L of a surfactant. The hole sealing agent disclosed by the invention can be used for effectively carrying out permeation exchange cleaning on a plating layer to realize an effective cleaning effect on the plating layer; and the hole sealingagent can form a film with the surface of the plating layer and reinforce the formed film layer, so that the corrosion resistance and the corrosion resistance of the plating layer are improved, and the galvanic effect of the plating layer is effectively reduced or avoided. The preparation method of the hole sealing agent is easy in control of process conditions and high in efficiency. The hole sealing agent can be applied to the fields of PCBs (Printed Circuit Boards) such as gold plating plates, so that the corrosion resistance and the corrosion resistance of the plating layers of the PCBs such as the gold plating plates are improved, the galvanic effect of the plating layers is reduced or avoided, and the zero-scrap production of the PCB such as the gold plating plates is realized.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a sealing agent and its preparation method and application. Background technique [0002] The phenomenon that the state of the metal material is changed by the action of the surrounding medium, transformed into a new phase and then destroyed is called metal corrosion. When metal is exposed to the atmospheric environment, dust, corrosive gas, organic gas, etc. in the air will cause it to corrode and generate insulating foreign objects. In a dry environment, the surface of metal tin, copper, and silver is prone to dry corrosion, mainly oxidation and vulcanization; in a humid environment, corrosive gas or dust in the air dissolves in water to form an electrolyte, causing electrochemical corrosion. It is estimated that the annual direct loss due to metal corrosion accounts for about 1.5%-4.2% of the gross national economic output. [0003] At present, common meta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28C23C18/42
CPCC23C18/1689C23C18/42H05K3/282H05K3/285
Inventor 邱成伟黄生荣李小海王晓槟
Owner ZHUHAI CHINA EAGLE ELECTRONIC CIRCTCUIS CO LTD
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