Epoxy potting compound for rotary module and preparation method and application method of epoxy potting compound

Abstract

The invention belongs to the technical field of epoxy potting compounds, and particularly relates to an epoxy potting compound for a rotary module. The epoxy potting compound comprises epoxy resin, acuring agent, silica powder, talcum powder and triethanolamine in the weight ratio of 100:75: 200:20:0.5. A preparation method includes the steps that 1, the silicon powder and the talcum powder are dried and kept warm for later use; 2, the epoxy resin and a coloring agent in a formula ratio are poured into a container, heated and diluted; 3, the silicon powder and the talcum powder are put into the container to be evenly stirred; 4, the mixture is cooled, and the curing agent is added and stirred evenly; 5, filtering is carried out; 6, an accelerant is added into the filtrate and uniformly stirred. An application method comprises the steps that 1, a syringe is used for sucking the epoxy potting compound, the epoxy potting compound is injected into the rotary module, and the epoxy pottingcompound is basically flush with an upper opening of the module; 2, the epoxy potting compound is put into the drying oven to be dried. The epoxy potting compound is high in strength, the cracking resistance and spin-off resistance of the product are improved, and the rotary module using the epoxy potting compound can bear the centrifugal force and vibration of a rotor.

Description

technical field [0001] The invention belongs to the technical field of epoxy potting compound, and in particular relates to an epoxy potting compound for a rotary module. Background technique [0002] The rotary module is used for the generator, supplying it with field current. Installed on the rotor, it bears great centrifugal force and vibration during use. The general epoxy potting compound is not strong enough, and it is easy to crack and fall off during use, resulting in device failure and failure to generate electricity. [0003] The Chinese invention patent with the publication number CN102863936A and the publication date of January 9, 2013 discloses a heat-curable two-component epoxy potting adhesive, which includes component A and component B, and component A includes the following parts by weight Ingredients: epoxy resin 70-130; first inorganic filler 150-280; diluent 0-25; toughening agent 0-15; silicone defoamer 0-3; pigment 0-3; B component includes the follow...

AI Technical Summary

Problems solved by technology

The epoxy potting adhesive with the above formula has many types of components. Although the thermal conductivity, insulation performance, mechanical strength and other comprehensive properties of the epoxy potting adhesive are improved, it is very important for improving the service life of high-power electronic components and reducing maintenance. The cost has a great effect, the viscosity is low, the fluidity is good, and the storage period is prolonged; but it does not disclose its anti-cracking and anti-snap-off performance under rotation

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