Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Flexible organic package composition and preparing and use method thereof

A composition and organic technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as cracking or falling off, and achieve the effects of easy operation, high product purity, and less side reactions

Active Publication Date: 2019-08-13
XIAN SMART MATERIALS CO LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This phenomenon can cause cracking or peeling between the device and the organic barrier film or between the organic barrier film and the inorganic film

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible organic package composition and preparing and use method thereof
  • Flexible organic package composition and preparing and use method thereof
  • Flexible organic package composition and preparing and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0041] The preparation method of the composition of the flexible organic package of the present invention is: according to the mass percentage, in a brown glass container, add silicon-based epoxy active monomer, acrylate active monomer, diluent, photoinitiator and auxiliary agent, and then After shaking and mixing at room temperature for 2 hours, the composition for encapsulation was obtained.

[0042] The use method of the composition of the flexible organic package of the present invention is: firstly, the composition of the flexible organic package is uniformly attached on the required surface by flash evaporation, inkjet printing, deposition, screen printing, spin coating or doctor blade coating. The encapsulated device surface is then irradiated by UV to promote the formation of an organic encapsulation film.

[0043] The present invention also proposes a preparation method of more than one component-silicon-based epoxy A: prepare 100 parts of vinyl epoxy, 10-50 parts of ...

Embodiment a

[0049] The preparation method of the silicon-based epoxy A of the present embodiment may further comprise the steps:

[0050] 1a) Weigh the hydrogen-containing siloxane and solvent into the beaker, stir it with a glass rod to make it evenly mixed, then blow nitrogen into it for 5-10 minutes, and finally add it into the three-necked flask, and carry out under nitrogen atmosphere Constant temperature magnetic stirring;

[0051] 2a) Then weigh the vinyl epoxy monomer and the catalyst, mix them uniformly and drop them into the solution in 1a), the dropping time is 20-40min;

[0052] 3a) After the dropwise addition reaction is completed, the reaction temperature is raised, and stirred under constant temperature reflux under a nitrogen atmosphere. After the reaction is completed, a solvent removal treatment is performed to obtain a light yellow viscous liquid.

[0053] Wherein, the mass ratio of vinyl epoxy, hydrogen-containing siloxane, catalyst and solvent is 100:20:3:150.

[00...

Embodiment b

[0059] The preparation method of silicon-based epoxy A of the present embodiment comprises the following steps:

[0060] 1a) Weigh the hydrogen-containing siloxane and solvent into the beaker, stir it with a glass rod to make it evenly mixed, then blow nitrogen into it for 5-10 minutes, and finally add it into the three-necked flask, and carry out under nitrogen atmosphere Constant temperature magnetic stirring;

[0061] 2a) Then weigh the vinyl epoxy monomer and the catalyst, mix them uniformly and drop them into the solution in 1a), the dropping time is 20-40min;

[0062] 3a) After the dropwise addition reaction is completed, the reaction temperature is raised, and stirred under constant temperature reflux under a nitrogen atmosphere. After the reaction is completed, a solvent removal treatment is performed to obtain a light yellow viscous liquid.

[0063] Wherein, the mass ratio of vinyl epoxy, hydrogen-containing siloxane, catalyst and solvent is 100:30:4:250.

[0064] T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flexible organic package composition and a preparing and use method thereof. The composition comprises, by mass, 10-80% of an epoxy active monomer, 10-80% of an acrylic esteractive monomer, 5-40% of a diluent, 0.5-10% of a photoinitiator and 0.5-10% of an aid. The diluent is a single-functionality-degree acrylic ester or epoxy. The photoinitiator is a free radical photoinitiator or a cation photoinitiator. The composition has the advantages of being high in light permeability, high in curing rate, low in volume shrinkage and free of the oxygen inhibition phenomenon and having dark reaction; by mixing an epoxy system and an acrylic ester system, the interpenetrating network structure is formed in the curing process, and the volume compensation, performance compensation and cost compensation of the two systems are realized.

Description

technical field [0001] The invention belongs to the technical field of organic thin films, and relates to organic thin film encapsulation, in particular to a flexible organic encapsulation composition and its preparation and use methods. Background technique [0002] With the development of science and technology and the continuous innovation of the industrial field, the traditional packaging technology used for rigid substrates (such as: steel plate, acrylic, glass, ceramics and other hard materials) can no longer fully meet the industrial needs, but the emergence of thin film packaging technology This problem is properly solved, and the thin-film packaging technology can be used not only for the packaging of rigid substrates, but also for the packaging of flexible materials. [0003] In the organic thin film encapsulation technology, the thin film is generally formed by methods such as thermal curing or radiation curing of certain energy rays. Among many curing methods, U...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09D4/06C09D4/02H01L23/29
CPCC09D4/06H01L23/296
Inventor 刘育红吴朝新吉静茹张弛
Owner XIAN SMART MATERIALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com