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Loop heat pipe with pipe diameter of heat absorption part larger than pipe diameter of condensation part

A loop heat pipe and evaporator technology, applied in the field of heat pipes, can solve problems such as uneven separation of partition devices, excessive local temperature, and narrow area of ​​space A, so as to avoid uneven partition, improve heat exchange effect, and improve steady flow effect of effect

Inactive Publication Date: 2019-08-02
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The impact phenomenon will cause large noise vibration and mechanical shock, causing damage to the equipment
[0006] In addition, due to the existence of vapor-liquid problems, the vapor and liquid are separated from each other in the heat exchange, so that the gas and liquid cannot be fully mixed, which affects the heat exchange effect, resulting in uneven heat exchange, and local temperatures are too high or too low
[0007] The inventor has also designed a variety of heat pipe devices to solve the above problems in the previous application, such as multi-pipe type, but this kind of device has been found in operation, because the pipes are closely combined, so the heat pipe formed between the three pipes Space A is relatively small, because space A is formed by the convex arc of three pipes, so most of space A is narrow, which will make it difficult for the fluid to enter and pass through, resulting in a short circuit of the fluid, which affects the heat exchange of the fluid and cannot play a good role. steady flow
Simultaneously because the many tubes of above-mentioned structure are combined together, manufacture difficulty
Another example is the 2017102671998 structure. Although this structure solves the fluid short circuit phenomenon, there is a problem that the flow area is greatly reduced, resulting in an increase in flow resistance.
Another example is the annular partition device of 2017102949490. In the annular structure, the partition device adopts a ring structure, which leads to the uneven separation of the annulus of the partition device in the circumferential direction, and because of the ring structure, the positions of the four included angles of the annulus appear less than Acute angles of 90 degrees, which can cause problems with shorting fluid flow at acute angles less than 90 degrees
[0008] In view of the above problems, the present invention improves on the basis of the previous invention, and provides a new heat pipe, so as to solve the problem of uneven heat transfer in the case of heat pipe heat exchange.

Method used

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  • Loop heat pipe with pipe diameter of heat absorption part larger than pipe diameter of condensation part
  • Loop heat pipe with pipe diameter of heat absorption part larger than pipe diameter of condensation part
  • Loop heat pipe with pipe diameter of heat absorption part larger than pipe diameter of condensation part

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Embodiment Construction

[0061] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0062] In this article, if there are no special instructions, when it comes to formulas, " / " means division, and "×" and "*" mean multiplication.

[0063] Such as figure 1 The loop heat pipe 1 shown includes an evaporation part 11, a condensation part 12, and a heat insulation part 13 and a return part 14 connecting the evaporation part and the condensation part. The fluid absorbs heat and evaporates in the evaporation part 11 and enters the condensation part through the heat insulation part 13 12. The condensed fluid is condensed after heat exchange in the condensing part 12, and the condensed fluid returns to the evaporating part 11 through the return pipe 14. Preferably, the return part is also insulated.

[0064] As an improvement, the evaporator includes a heat absorption tube, and a partition device 3 is arranged in the heat absorption tube....

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Abstract

The invention relates to a loop heat pipe. The loop heat pipe comprises an evaporation part, a condensation part, a heat insulation part connecting the evaporation part and the condensation part, anda backflow part, wherein fluid absorbs heat and evaporates in the evaporation part, enters the condensation part through the heat insulation part, and condenses after heat exchange in the condensationpart, and the condensed fluid returns to an evaporation header through a backflow pipe. The loop heat pipe is characterized in that the evaporation part comprises a heat absorption pipe, the backflowpart comprises a condensation pipe, and the pipe diameter of the heat absorption pipe is larger than that of the condensation pipe. The loop heat pipe with the novel structure mainly increases the resistance of the condensation pipe and reduces the resistance of the evaporation part, so that steam can flow more easily from the evaporation part and the loop heat pipe can better form circulation.

Description

Technical field [0001] The invention belongs to the field of heat pipes, and particularly relates to a loop heat pipe. Background technique [0002] Heat pipe technology is a kind of heat transfer element called "heat pipe" invented by George Grover of Los Alamos National Laboratory in the United States in 1963, which makes full use of the principle of heat conduction and phase change medium The rapid heat transfer properties of the heat pipe can quickly transfer the heat of the heating object to the heat source, and its thermal conductivity exceeds the thermal conductivity of any known metal. [0003] Heat pipe technology was previously widely used in aerospace, military and other industries. Since being introduced into the radiator manufacturing industry, people have changed the design thinking of traditional radiators and got rid of the single heat dissipation mode that relies solely on high-air-volume motors to obtain better heat dissipation. The use of heat pipe technology en...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/02
CPCF28D15/0266
Inventor 郭春生江程年显勃马军陈子昂李言伟谷潇潇薛于凡李红云武晓阳辛华钰
Owner SHANDONG UNIV
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