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Circuit substrate, laminated semiconductor assembly, and manufacturing method thereof

A manufacturing method and technology for circuit substrates, which are applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as peeling, component failure, solder deformation, etc., and achieve the effect of improving wiring flexibility

Inactive Publication Date: 2019-07-23
BRIDGE SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, solder deformation and cracks may occur during the embedding process, or peeling may occur between the sealing material and the substrate after thermal cycles, resulting in sudden component failure and failure to connect to I / O.

Method used

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  • Circuit substrate, laminated semiconductor assembly, and manufacturing method thereof
  • Circuit substrate, laminated semiconductor assembly, and manufacturing method thereof
  • Circuit substrate, laminated semiconductor assembly, and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0105] Figure 1-16In the first embodiment of the present invention, a diagram of a manufacturing method of a semiconductor assembly, which includes a plurality of metal leads, a metal pad, a metal film, a resin compound, a semiconductor element, a plurality of bonding wires and a molding material.

[0106] figure 1 , figure 2 and image 3 They are a schematic cross-sectional view, a top perspective view and a bottom perspective view of the patterned metal plate 10, respectively. The patterned metal plate 10 is usually made of copper alloy, steel or alloy 42, which can be formed by wet etching or stamping / punching process on rolled metal strip. , wherein the rolled metal strip has a thickness ranging from about 0.15 mm to about 1.0 mm. Here, the etching process can be performed from one side or both sides to etch through the metal strip, and the metal strip is made into a patterned metal plate 10 with a predetermined overall pattern, which includes a metal frame 11, a pl...

Embodiment 2

[0129] Figure 38-45 It is a diagram of the fabrication method of the circuit substrate with the top build-up circuit in the second embodiment of the present invention.

[0130] For the purpose of brief description, any narration that can be used for the same application in the above-mentioned embodiment 1 is all incorporated here, and need not repeat same narration again.

[0131] Figure 38 and Figure 39 respectively Figure 4 Schematic cross-sectional view and bottom perspective view of the structure after the metal frame 11 is removed. The metal frame 11 can be removed by various methods including chemical etching, mechanical trimming / cutting or sawing. By separating the metal frame 11, the connection between the metal leads 13 can be severed. Accordingly, the patterned metal plate 10 includes metal leads 13 , metal blocks 15 and connecting rods 16 .

[0132] Figure 40 and Figure 41 A schematic cross-sectional view and a perspective view of the bottom of the die...

Embodiment 3

[0140] Figure 50-61 It is a diagram of the manufacturing method of the semiconductor assembly in which the semiconductor element is attached to the resin pad in the third embodiment of the present invention.

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Abstract

The wiring substrate includes a cavity and a plurality of metal leads disposed around the cavity. The metal leads are bonded with a resin compound and provide horizontal and vertical routing for a semiconductor device to be disposed in the cavity. The resin compound fills in spaces between the metal leads and surrounds the cavity and provides a dielectric platform for a re-distribution layer or abuild-up circuitry optionally deposited thereon.

Description

technical field [0001] The present invention relates to a circuit substrate, its semiconductor assembly and its manufacturing method, especially to a circuit substrate provided with a series of metal leads surrounding cavities and a laminated semiconductor assembly using the circuit substrate and its manufacturing method. Wherein the metal leads can be used as vertical interconnection channels. Background technique [0002] The market trend of multimedia devices tends to be faster and thinner. One of the methods is to assemble a plurality of components on the circuit substrate in a stacked manner, so that the electrical performance can be improved and more miniaturized. U.S. Patent No. 7,894,203 discloses a circuit substrate with recesses based on this purpose. The substrate is formed by bonding two separate parts with an adhesive, and an electrical connection is formed between the two parts through a conductive material (such as solder or a conductive bump). Since the su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/768H01L23/538
CPCH01L21/76895H01L23/5386H01L2224/18
Inventor 林文强王家忠
Owner BRIDGE SEMICON
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