A defect repair method based on integrally formed heat-resistant materials for returnable spacecraft
A technology for a returnable spaceship and a heat-proof material, which is applied in the field of repairing the defects of the integrally formed heat-proof material for the returnable spaceship, can solve the problems of a long preparation period, uneven local density and complicated process of the integrally formed heat-proof material of the returnable spaceship , to achieve the effect of ensuring flatness, ensuring bonding strength, and ensuring bonding strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0050] Carry out X-ray and visual flaw detection for an integrally formed heat-resistant material in the aerospace field. After the defect is found, the defect position is marked according to the detection. The maximum defect size range is 60mm*60mm, and the depth is 4mm.
[0051] Machining: Use mechanical processing methods to remove all heat-resistant materials at the defect position according to the marked defect position. The removal size is 110mm*110mm and the depth is 6mm.
[0052] Machining of repairing and filling blocks: select the blank that is consistent with the raw material of the integrally formed heat-resistant material to prepare mechanically processed repairing and filling blocks. According to the size of the removal position, the repair and filling blocks are processed into squares, and the shape and removal position require (+0.5~+1) mm glue joint gap, after the repair block is glued, there must be no 2mm step difference between the height direction of the he...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com