Thermosetting resin composition, prepreg comprising same, metal-foil-coated laminate and printed circuit board

Abstract

The invention provides a thermosetting resin composition, a prepreg comprising the same, a metal-foil-coated laminate and a printed circuit board. The resin composition comprises a combination or prepolymer of bismaleimide resin and benzoxazole resin, epoxy resin and active ester. The metal-foil-coated laminate prepared from the resin composition has high glass transition temperature, low thermalexpansion coefficient, high high-temperature modulus, high peel strength, low dielectric constant, low dielectric loss factor, high heat resistance and high process machinability.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and relates to a thermosetting resin composition, a prepreg containing the same, a metal foil clad laminate and a printed circuit board. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and the dielectric constant (Dk) and dielectric loss value (Df) are required to be lower and lower. Therefore, reducing Dk / Df has become the pursuit of the substrate industry. hotspot. In order to achieve low Dk and low Df, various low polar resins such as styrene-maleic anhydride oligomers (SMA) are widely used, SMA can endow the substrate with excellent dielectric properties and heat resistance, etc., but there is water absorption The problem of high rate and large coefficient of thermal expansion (CTE). [0003] At present, although general copper clad laminates can achieve...

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Problems solved by technology

The resin composition comprises: 15-55% of amine-modified bismaleimide (BMI), 10-45% of benzoxazine resin and 0-75% of epoxy resin according to the weight percentage of each component. %, although the dielectric properties and temperature resistance of the copper clad laminate are improved, the T of the composition g , dielectric constant and dielectric loss and other properties still have a lot of room for improvement

CN104845363 discloses a halogen-free resin composition and its application. The halogen-free resin composition contains (A) 40-80 parts by weight of allyl-modified benzoxazine resin in terms of parts by weight of organic solids; (B) ) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl-modified polyphenylene ether resin; (D) 10-20 parts by weight of bismaleimide resin modified by allyl group; (E) 0.01-3 parts by weight of initiator; (F) 10-100 parts by weight of filler and (G) 0-80 parts by weight of phosphorus-containing flame retardant, the laminated board finally obtained by this invention has lower Dk and Df, And good flame retardant effect, but because some components need to be self-made, the cost is high and the preparation method is complicated; and, the glass transition temperature T of the laminated board obtained finally g There is still room for further improvement in CTE, etc.

CN107459650A discloses a modified bismaleimide resin prepolymer and a preparation method thereof, using a melting process, utilizing allyl compounds, aminophenylacetylene, and benzoxazine to carry out copolymerization and expansion of bismaleimide Chain toughening modification, the obtained modified bismaleimide resin prepolymer has high heat resistance, but the dielectric properties and dielectric loss properties of the material were not considered in the modification process

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