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SLA flexible photosensitive resin for 3D printing and preparation method thereof

A photosensitive resin and 3D printing technology, applied in the direction of additive processing, etc., can solve the problems of small hardness adjustable range, difficulty in meeting actual needs, and low elongation at break of photosensitive resin, achieving high elongation at break and adjustable hardness Wide range of effects

Active Publication Date: 2019-05-21
浙江浙创三维科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The elongation at break of the photosensitive resin prepared by the above method is low, and the adjustable range of hardness is small, so it is difficult to meet the actual needs of different application fields.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The technical solution adopted in this embodiment is a preparation method of SLA flexible photosensitive resin for 3D printing, and the steps of the preparation method are:

[0028] (1) After dissolving the initiator in the monomer raw material, add the pigment, stir to obtain a mixed liquid, and the stirring speed is 500r / min;

[0029] In parts by weight, the monomer raw material is 60 parts of methoxy polyethylene glycol acrylate, the initiator is 2 parts of 1-hydroxy-cyclohexyl benzophenone, and the pigment is 0.5 part of carbon black;

[0030] (2) Add the toughening agent to the mixed liquid under stirring conditions at 50°C to obtain a pre-mixed liquid, and the stirring speed is 600r / min;

[0031] In parts by weight, the toughening agent is 10 parts of epoxidized polybutadiene;

[0032] (3) Add the resin raw material and defoamer to the pre-mixed liquid at 40°C and stirring conditions, stir and mix thoroughly, then sieving to obtain SLA flexible photosensitive resin for 3D p...

Embodiment 2

[0036] The SLA flexible photosensitive resin for 3D printing of this embodiment, its raw material composition and preparation method are similar to those of embodiment 1, the difference is that the preparation method of this embodiment also includes the step (4) static defoaming: The SLA flexible photosensitive resin for 3D printing obtained after sieving was vacuum defoamed; the temperature was 50° C. and the time was 2 hours.

[0037] Use a light-curing 3D printer to print the model of the SLA flexible photosensitive resin prepared in step (4). The surface of the model is smooth and high in fineness. After curing, the hardness of the model is 89A and the elongation at break is 185%; the machine used is: The lite 100 model SLA printer produced by Shanghai Liantai Technology Co., Ltd., printing power: 350mw, filling speed: 5000mm / s; use the Shore A hardness tester to test the surface hardness, using the US INSTRON3343 electronic universal material testing machine Test the elongat...

Embodiment 3

[0039] The technical solution adopted in this embodiment is a preparation method of SLA flexible photosensitive resin for 3D printing, and the steps of the preparation method are:

[0040] (1) After dissolving the initiator in the monomer raw material, add the pigment, stir to obtain a mixed liquid, and the stirring speed is 500r / min;

[0041] In parts by weight, the monomer raw material is 50 parts of 1,4-butanediol diacrylate, and the initiator is 1.5 parts of bis-(2,4,6)-trimethylbenzoylphenyl phosphine oxide , The pigment is 1 part of carbon black;

[0042] (2) Add the toughening agent to the mixed liquid under stirring conditions at 50°C to obtain a pre-mixed liquid, and the stirring speed is 600r / min;

[0043] In parts by weight, the toughening agent is 5 parts of liquid polysulfide rubber;

[0044] (3) Add the resin raw materials and defoamer to the pre-mixed liquid under stirring conditions at 45°C, stir and mix well, and then sieving to obtain SLA flexible photosensitive resin...

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Abstract

The invention discloses a SLA flexible photosensitive resin for 3D printing. The SLA flexible photosensitive resin for 3D printing is prepared from the following raw materials in parts by weight: 30-70 parts of a monomer raw material, 30-60 parts of a resin raw material, 10-30 parts of a flexibilizer, 1-3 parts of an initiator, 0.01-1 part of a defoamer and 0.02-5 part of a pigment. A preparationmethod of the SLA flexible photosensitive resin comprises the following steps: dissolving the imitator in the monomer raw material, adding the pigment and stirring the mixture to obtain a mixed liquid; adding the flexibilizer into the mixed liquid to obtain a premixed liquid; and adding the resin raw material and the defoamer into the premixed liquid to be stirred and mixed fully and screening themixture to obtain the SLA flexible photosensitive resin for 3D printing. The SLA flexible photosensitive resin for 3D printing has excellent tear resistance and high elongation at break. The hardnessis 45-90A, the elongation at break is 180-250%, and the SLA flexible photosensitive resin is high in forming precision and wide in performance adjustable range, and can be used for developing and manufacturing products such as spacers and washers, creative garage kits and shoe soles.

Description

Technical field [0001] The invention relates to a photosensitive resin and a preparation method thereof, in particular to a SLA flexible photosensitive resin for 3D printing and a preparation method thereof, and belongs to the field of 3D printing new material development. Background technique [0002] With the continuous innovation and development of 3D printing technology and the gradual development of application fields, the market has increasingly urgent demands for diversified properties of 3D materials, especially new materials with excellent performance. Polymer materials are widely used in 3D printing technology. The main molding technologies include: Fused Deposition (FDM), Selective Laser Sintering (SLS) and Light Curing Molding. Among them, the light curing type 3D printing has smooth and smooth surfaces. The precise size and high production efficiency are favored by the market. Light curing molding is mainly divided into three-dimensional lithography (SLA) and digita...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L15/00C08L81/04C08L9/02C08L83/04C08F299/06C08F299/02C08F283/00C08F222/14C08F222/20B33Y70/00
Inventor 赵茜陶霖珊
Owner 浙江浙创三维科技有限公司
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