A preparation method of CVD diamond micro milling cutter based on laser and precision sharpening

Abstract

The invention discloses a method for preparing a CVD diamond micro milling cutter based on laser and precision sharpening. The preparation method includes: obtaining a three-dimensional model of a micro-milling cutter to be processed; determining a laser processing route according to the three-dimensional model; processing by a femtosecond laser processor according to the laser processing route to obtain an initial micro-milling cutter; The precision grinder grinds the initial micro-milling cutter to obtain a processed micro-milling cutter. Through the method or system, the CVD diamond micro milling cutter can be prepared quickly, with high quality and high efficiency.

Description

technical field [0001] The invention relates to the field of preparation of micro-milling cutters, in particular to a method for preparing CVD diamond micro-milling cutters based on laser and precision sharpening. Background technique [0002] In recent years, the miniaturization of equipment in the fields of aerospace, defense industry, electronics, medical treatment, bioengineering and communication has made their demand for tiny devices and parts increasing. Due to the high quality and reliability of micro-machining, and the ability to process more complex three-dimensional structures and three-dimensional curved surfaces, it has become the best choice for producing micro-parts and structures with feature sizes ranging from microns to millimeters and high precision shape requirements. One of the choices is also one of the key technologies connecting the macro and micro-nano fields. [0003] In micro cutting, micro tools are essential. Taking micro-milling as an example,...

AI Technical Summary

Problems solved by technology

Among diamond tools, PCD micro milling cutters are more common, but their edge sharpness and machinability are relatively low. Single crystal diamond micro milling cutters can obtain very sharp cutting edges, but they are prone to cleavage.

Chemical vapor deposition (CVD) diamond micro-milling cutters are close to single-crystal diamond micro-milling cutters in terms of performance. It has no cleavage caused by anisotropy and no easy-cutting surface, resulting in low processing efficiency by precision grinding.

[0004] Among the several existing methods of processing diamond micro-milling cutters, the wire electrode spark grinding (WEDG) process is not affected by the cutting force, is not limited by the hardness of the material, and has high processing efficiency. However, using this method, it has been The degenerated layer on the machined surface will reduce the strength of the tool and requires further processing; the preparation and dressing of precision grinding tools is mature, and it is the main processing technology for commercial micro-tools at present, but affected by the grinding force, the minimum forming diameter of the tool will change. Restricted; the nanosecond laser processing process has no vibration, the tool will not deform, and the processing cost is low, but there is a graphitized layer on the surface of the processed tool, the surface quality and accuracy are low, and the processing time is long;

[0005] Focused ion beam sputtering (FIB) is not limited by the material of the tool, the radius of the blunt circle of the cutting edge can be controlled below 1 μm, and the processing quality is high, but the processing equipment is expensive, the material removal speed is slow, and it is difficult to industrialize production; the ICP etching tool head is directly formed , no subsequent processing is required, but the welding of the head and handle is difficult

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