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A preparation process of ptfe ceramic composite high frequency copper clad laminate

A technology of ceramic compounding and preparation technology, which is applied in other household appliances, chemical instruments and methods, layered products, etc., can solve the problems of large dielectric loss of substrates, achieve low dielectric loss, adjustable and controllable viscosity, and reduce calcination temperature Effect

Active Publication Date: 2021-04-20
JIAXING GLEAD ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent ZL201410796601.8 discloses that a high-frequency LTCC circuit module substrate is prepared by adding LTCC co-fired ceramic powder to PTFE powder. The substrate prepared by this method has a large dielectric loss

Method used

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  • A preparation process of ptfe ceramic composite high frequency copper clad laminate
  • A preparation process of ptfe ceramic composite high frequency copper clad laminate

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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0029] Such as figure 1 and figure 2 Shown, the material and process preparation of a kind of PTFE ceramic composite high-frequency copper-clad laminate that the present invention proposes can be realized by following steps:

[0030] 1. Bake titanium dioxide (TiO2), magnesium oxide (MgO), manganese dioxide (MnO2), zinc oxide (ZnO), and calcium oxide (CaO) at 130oC for 24 hours, then by weight (25-35% magnesium oxide , 45-55% titanium dioxide, 0-5% manganese dioxide, 0-5% zinc oxide, 0-5% calcium oxide) weighed; weighed powder:...

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Abstract

The invention discloses a preparation process of a PTFE ceramic composite high-frequency copper clad laminate. 0-5% zinc oxide, 0-5% calcium oxide, etc.; Slurry formula composition: 10-40% ceramic filler; 40-60% PTFE emulsion; 0.3-3% coupling agent; 0-1 % of additives; the preparation process of PTFE ceramic composite high-frequency copper clad laminates, that is, PTFE ceramics can be obtained through processes such as pulping, glass cloth gluing, drying, slicing, sheeting, combined lamination, vacuum pressing, and cutting. Composite high frequency copper clad laminate. The preparation method of the invention can realize the high-precision dielectric constant, low dielectric loss and low water absorption rate of the dielectric constant of 3-6 series of the PTFE ceramic composite high-frequency copper clad laminate.

Description

technical field [0001] The invention belongs to the field of high-frequency copper-clad laminates used in microwave circuits, and in particular relates to a preparation process of PTFE ceramic composite high-frequency copper-clad laminates. Background technique [0002] In recent years, with the rapid development of microelectronic information technology, electronic products are developing towards high frequency and high speed, especially the rapid development of 5G communication technology, which has brought great impact on traditional PCB copper clad laminates. Traditional FR-4 The PCB board will not be able to meet the requirements of 5G communication, the development of a low-cost, high-performance high-frequency board is particularly important. In recent years, scientific and technological workers have conducted extensive and in-depth research on the material selection of high-frequency and high-speed substrate materials and related microwave characteristics and physica...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B5/02B32B15/20B32B15/18B32B7/04B32B33/00B32B38/16B32B37/06B32B37/10C08K3/24C08K3/22C08L27/18
CPCB32B5/02B32B7/08B32B15/18B32B15/20B32B33/00B32B37/06B32B37/1009B32B38/164B32B2260/021B32B2260/04B32B2260/046B32B2262/101B32B2307/204B32B2457/08C08K3/22C08K3/24C08K2003/2262C08K2003/2296C08L27/18
Inventor 易祖阳唐春宝许赛卿徐竞杰胡元云钮利耀
Owner JIAXING GLEAD ELECTRONICS CO LTD
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