A circuit repair method for high-precision circuit pcb

Abstract

The invention relates to the technical field of PCB circuit repair, and specifically discloses a circuit repair method for a high-precision circuit PCB. The circuit repair method comprises the following steps: increasing the contact area of the to-be-repaired circuit surface of the PCB and a repair gold wire; welding the repair gold wire to the to-be-repaired circuit surface of the PCB, and synthesizing a wire repair plate; applying pressure to the surface of the repair gold wire of the wire repair plate; extracting by using a first preset sampling proportion to complete AOI scanning for the repair wire plate in the previous step, and detecting whether the repair gold wire falls or not so as to increase the coarsening degree in the first step and / or increase the pressure applied in the third step. The circuit repair method has the obvious advantages that the to-be-repaired circuit surface and the surface of the gold wire are coarsened, so that the welding contact area of the gold wireand the circuit is increased, the resistance at the welding position can be reduced effectively, the electrification heat productivity is reduced, and the reliability of the product when in use is improved; the circuit and the surface of the gold wire are coarsened, the binding force between the gold wire and the circuit is improved, the gold wire is prevented from falling off in the subsequent procedure, and the internal proportion of the product is reduced.

Description

technical field [0001] The invention relates to the technical field of PCB circuit repair, in particular to a circuit repair method for high-precision circuit PCB. Background technique [0002] Usually, the line width and line spacing of high-precision circuit PCB are usually around 3mil (Chinese transliteration: mil, one mil is equal to one-thousandth of an inch, equal to 0.0254mm). It is easy to cause the following problems when wiring: [0003] 1) The width of the line repairing gold wire is too thin, it is easy to fall off during the manual moving process, and it is easy to move, forming an inward opening; [0004] 2) After the line is repaired, it is easy to fall off when passing through the horizontal cleaning line and the pre-treatment of solder mask, causing inward opening; [0005] 3) The gold wire after falling off is easy to overlap with other lines to form an inner short; [0006] 4) It is difficult to find the poorly repaired lines in the follow-up, and conti...

AI Technical Summary

Problems solved by technology

[0009] The invention provides a circuit repair method for high-precision circuit PCB. The technical problem to be solved is that the existing repairing process of first repairing the wire and then pressing the foot is easy to cause shedding due to the small welding area and insufficient pressure.

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