A new type of "sandwich" structure flexible hot film microsensor and its manufacturing method

Abstract

The invention discloses a novel ''sandwich'' structure flexible hot-film micro sensor and a manufacturing method thereof, which belong to the field of micro electro mechanical systems (MEMS). The novel ''sandwich'' structure flexible hot-film micro sensor adopts a three-layer thin film structure of a top-layer thermosensitive unit 5, an intermediate insulating layer 3 and an underlying heating unit 6, wherein the top-layer thermosensitive unit 5 and the underlying heating unit 6 are electrically isolated by means of the intermediate insulating layer 3, and operate independently of each other.The top-layer thermosensitive unit 5 and the underlying heating unit 6 are of identical and symmetric structure size with the same operating temperature, eliminate the heat conduction from the top-layer thermosensitive unit to a substrate, greatly improve the measurement precision and dynamic properties of the sensor, realizes manufacturing of the sensor structure by means of thin film depositionand twice photolithography processes, and ensures the spatial position relationship between the top-layer thermosensitive unit 5 and the underlying heating unit 6.

Description

[0001] Technical field: [0002] The invention relates to a novel "sandwich" structure flexible thermal film microsensor and a manufacturing method thereof, which belong to the field of micro-electromechanical systems (MEMS). Background technique: [0003] As one of the basic fluid mechanics parameters, the fluid wall shear stress (friction stress) is an important physical quantity to accurately control the friction resistance and understand the flow state of the boundary layer. Its effective measurement can significantly improve the technical level of fluid experiment testing. In turbulent flow, the boundary layer has a time scale on the order of microseconds and a length scale on the order of microns. The test of turbulent pulsating shear stress puts forward higher requirements on the performance of the sensor, and the traditional test methods cannot meet the measurement requirements. The development of micro-electromechanical systems (MEMS) technology provides a new method...

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of this sensor structure is that although it reduces the heat dissipation of the thermal unit to the substrate, it does not completely eliminate

The convective heat transfer between the thermal unit and the fluid in the cavity structure still restricts the improvement of sensor measurement accuracy and dynamic characteristics

Images