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Copper-based resin prepreg production equipment for mobile communication circuit boards

A mobile communication, prepreg technology, applied in other manufacturing equipment/tools, manufacturing tools, etc., can solve the problems of low yield rate of copper clad laminate production, uneven composition of prepreg, inclusion of air bubbles, etc., to avoid premature curing, reduce air bubble content, The effect of preventing excessive leakage

Pending Publication Date: 2019-04-02
XIAN HUAYUN TIANCHENG COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a copper-based resin prepreg production equipment for mobile communication circuit boards. The copper-based resin prepreg produced and the reinforcing material are laminated at high temperature to make a copper-clad laminate, which solves the problems in the prior art. And during the curing process of the glue, defects such as air inclusions and uneven composition of the prepreg are prone to occur, resulting in problems such as a decrease in the yield of copper-clad laminates.

Method used

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  • Copper-based resin prepreg production equipment for mobile communication circuit boards
  • Copper-based resin prepreg production equipment for mobile communication circuit boards
  • Copper-based resin prepreg production equipment for mobile communication circuit boards

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Embodiment Construction

[0026] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0027] Such as Figure 1 to Figure 5 As shown, a copper-based resin prepreg production equipment for mobile communication circuit boards, including a copper foil reel 1, a polishing device 2, a coating device 3 and a cutting device 4 arranged in sequence from front to back, installed in the coating device 3 and the drying device 5 below the cutting device 4, and the glue supply device 7 connected to the coating device 3 through the delivery pipe 6.

[0028] The coating device 3 includes a gantry 31, a single screw pump 32, an extrusion part 33 and a sealing device 34; the gantry 31 includes a column 311, a screw motor 312, a nut 313 and a pump bracket 314 on each of the left and right sides, A screw motor 312 is respectively installed on the co...

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Abstract

The invention relates to the technical field of copper-clad plate production for mobile communication circuit boards, in particular to copper-based resin prepreg production equipment for the mobile communication circuit boards. The equipment comprises a copper foil winding drum, a grinding device, a coating device and a cutting device, a drying device and a glue supply device, wherein the copper foil winding drum, the grinding device, the coating device and the cutting device are sequentially arranged from front to back, the drying device is installed below between the coating device and the cutting device, and the glue supply device is connected with the coating device through a conveying pipe. A copper-based resin prepreg produced by using the equipment and reinforcing materials are laminated at high temperature to manufacture a copper-clad plate, so that the problem that in the prior art, the yield of copper-clad plate production is reduced due to the fact that defects such as inclusion of bubbles, uneven composition of the prepreg are prone to occurring in the processes of gum dipping and curing of the reinforcing materials is solved.

Description

technical field [0001] The invention relates to the technical field of production of copper-clad laminates for mobile communication circuit boards, in particular to copper-based resin prepreg production equipment for mobile communication circuit boards. Background technique [0002] Copper clad laminate, the full name of copper clad laminate, is the basic material of the electronics industry, mainly used for processing and manufacturing printed circuit boards, and is widely used in the field of mobile communications. [0003] The traditional copper-clad laminate is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. With the development of copper clad laminate materials, more and more auxiliary materials are added to the glue. In the process of dipping the reinforcing material and curing the glue, defects such as air inclusions and uneven composition...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P23/06
CPCB23P23/06
Inventor 马瑞
Owner XIAN HUAYUN TIANCHENG COMM TECH
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