Copper-clad laminate production equipment and copper-clad laminate processing method

Abstract

The invention relates to the field of copper-clad plate production, and particularly discloses copper-clad plate production equipment and a copper-clad plate processing method. The equipment comprisesa first coating device, a first roller, a second coating device, a first rolling device, a second roller and a second rolling device which are arranged front the front part to the rear part in sequence, wherein baking devices are arranged on the front side of the first rolling device, between the first rolling device and the second device, and on the rear side of the second rolling device; the structure of the first coating device is the same with that of the second coating device; the structure of the first roller is the same with that of the second roller. Through the copper-clad plate production equipment and the copper-clad plate processing method, the problem, in the prior art, of low copper-clad plate production yield caused by defects like air bubble inclusion and nonuniform prepreg components during reinforcing material glue dipping and glue solution curing processes can be solved.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate production, in particular to a copper clad laminate production equipment and a copper clad laminate processing method. Background technique [0002] Copper-clad laminate, the full name of copper-clad laminate, is the basic material of the electronics industry. It is mainly used for processing and manufacturing printed circuit boards, and is widely used in electronic products such as computers, displays, and mobile communications. [0003] The traditional copper-clad laminate is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. With the development of copper clad laminate materials, more and more auxiliary materials are added to the glue. In the process of dipping the reinforcing material and curing the glue, defects such as air inclusions and uneven composit...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a copper-clad laminate production equipment and a copper-clad laminate processing method, which are economical and efficient, and solve defects such as air inclusions and uneven components of the prepreg that are prone to occur in the prior art during the reinforcement material impregnation and glue curing process. Leading to problems such as lower yield rate of CCL production

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