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LED COB packaging method and LED packaging module

A packaging method and module technology, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of difficult yield, cumbersome process, breakdown of pixel units, etc., to improve production efficiency and yield, and improve production efficiency. , The effect of preventing electrostatic breakdown

Pending Publication Date: 2019-03-22
深圳市新光台显示应用有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these packaging processes have the problems of cumbersome process, difficult control of yield rate, and high packaging and manufacturing cost of LED display module COB.
[0008] In addition, the LED display module manufactured according to the existing packaging process is not good for the protection of the pixel unit due to the limitation of the glue sealing method. Touching the LED display module will cause the pixel unit to be broken down
[0009] Moreover, due to the limitation of the existing glue sealing method, it is difficult to manufacture an LED display module with a dot pitch ≤ 1mm

Method used

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  • LED COB packaging method and LED packaging module
  • LED COB packaging method and LED packaging module
  • LED COB packaging method and LED packaging module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] image 3 A flow chart of the COB packaging method for LEDs provided in this embodiment, Figure 4 The state diagram of the glue pouring process of the COB packaging method of the LED provided in this embodiment is combined below image 3 with Figure 4 This embodiment will be specifically described.

[0065] Such as image 3 As shown, the COB packaging method of LED provided in this embodiment at least includes the steps:

[0066] S100: Fix each LED light-emitting chip to the front of the PCB board;

[0067] S200: Connect each LED light-emitting chip to the PCB board by soldering with wires;

[0068] S300: Apply glue to the front of the PCB board according to the preset spraying method, so that each LED light-emitting chip and the entire front surface of the PCB board are continuously covered with glue;

[0069] S400: Leave the PCB board after glue pouring and potting to stand, and bake and solidify after the glue is solidified.

[0070] In this embodiment, the g...

Embodiment 2

[0097] The red light LED chip, the green light LED chip and the blue light LED chip in the LED light-emitting chip are respectively fixed on the PCB board through silver paste or insulating glue.

[0098] Connect the positive electrode of the red LED chip to the positive electrode pad on the PCB through a wire, and the negative electrode of the red LED chip is directly connected to the negative electrode pad on the PCB; connect the positive and negative electrodes of the green LED chip and the blue LED chip The poles are respectively connected to the positive and negative pads on the PCB through wires.

[0099] Multiple glue guns 600 are arranged at equal intervals on the first end 101 of the PCB, and the multiple glue guns 600 are placed above the PCB. There can be 2-5 glue guns, for example, 3 glue guns. Control the glue outlet of each glue gun to discharge glue continuously and evenly. Three glue guns spray glue on the PCB board at the same time, and spray glue continuousl...

Embodiment 3

[0103] Figure 5 A schematic diagram of the longitudinal section structure of the LED packaging module provided in this embodiment, Image 6 The top view of the LED packaging module provided by this embodiment, Figure 7 A partial schematic diagram of the LED packaging module provided for this embodiment, combined below Figure 5-7 This embodiment will be specifically described.

[0104] Such as Figure 5 As shown, the LED packaging module prepared according to the LED COB packaging method described in the above embodiments includes: a PCB board 100, a plurality of LED light-emitting chips 200 and a colloidal layer 300;

[0105] A plurality of LED light-emitting chips 200 are fixed on the front of the PCB board 100, and each LED light-emitting chip 200 is electrically connected to the PCB board 100 through a wire 400;

[0106] The colloidal layer 300 is covered on the front of the PCB 100 by pouring glue, so that each LED light-emitting chip 200 and the entire front of the P...

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Abstract

The invention discloses a LED COB packaging method and an LED packaging module, which belong to the technical field of LED display screen packaging. The LED COB packaging method comprises the steps of: fixing each LED light-emitting chip to the front side of a PCB; conducting each of the LED light-emitting chips with the PCB through soldering by means of a conductive wire; performing glue sprayingand potting on the front side of the PCB according to a preset shower coating manner, so that each LED light-emitting chip and the whole surface of the front side of the PCB are coated by the glue; and allowing the PCB after glue spraying and potting to stand, and baking and curing the PCB after the glue is solidified. The LED COB packaging method is simple in process, can improve the productionefficiency and the yield of LED display modules, can effectively prevent the LED light-emitting chips from being broken down, and can easily manufacture an LED display screen with dot spacing less than or equal to 1 mm.

Description

technical field [0001] The application relates to a COB packaging method for LEDs and an LED packaging module, belonging to the technical field of LED display packaging. Background technique [0002] With the rapid development of LED display technology, the application of LED display screens is becoming more and more extensive. [0003] In the prior art, the main LED display module packaging methods include: SMD (Surface Mounted Devices, Surface Mounted Devices) packaging and COB (Chip on Board) packaging. SMD packaging has high thermal resistance, poor heat dissipation, and glare problems. It needs to attach the device to a fixed substrate during application, and it can only be used in the display field that does not require high product performance. Compared with SMD packaging, the performance of COB packaging is greatly improved, and steps such as brackets, reflow soldering, and SMT processes are omitted, and glare problems can also be effectively avoided. The price / per...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L33/56H01L33/62H01L25/075
CPCH01L25/075H01L33/52H01L33/56H01L33/62
Inventor 游之东雷均勇黄剑波冯金山李建伟
Owner 深圳市新光台显示应用有限公司
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