Circuit board with electromagnetic shielding function and manufacturing method thereof

Abstract

A method for manufacturing a circuit board with an electromagnetic shielding function, comprising the steps of: providing a single-sided copper-clad substrate, the single-sided copper-clad substrate including a first base material layer and a first copper foil layer; The material layer includes a first surface and a second surface opposite to the first surface, the first copper foil layer is formed on the first surface; a first low-loss dielectric layer is formed on the second surface ; forming at least one first receiving hole through the first low-loss dielectric layer and the first substrate layer and filling the first receiving hole with a first conductive paste, thereby forming a first electromagnetic shielding layer; and providing A circuit substrate and the first electromagnetic shielding layer is laminated on the circuit substrate, the circuit substrate includes a first conductive circuit layer, and the first conductive paste is directly electrically connected to the first conductive circuit layer and the first copper foil Floor. The invention also relates to a circuit board with electromagnetic shielding function.

Description

technical field [0001] The invention relates to the field of electromagnetic shielding manufacturing, in particular to a circuit board with electromagnetic shielding function and a manufacturing method thereof. Background technique [0002] When common electronic equipment is working, because of the intermittent or continuous change of the working voltage and current, the internal electronic components will often cause electromagnetic radiation energy of a certain frequency, which will radiate to the surrounding environment and cause damage to the adjacent electronic components. interference, or even cause the adjacent electronic components to fail to work properly. Moreover, as mid-to-high-end consumer electronics products have higher quality requirements, their requirements for electromagnetic shielding are also getting higher and higher. [0003] Common electronic equipment implements electromagnetic shielding by adding a shielding cover locally on the circuit board. Spe...

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Problems solved by technology

[0004] However, the circuit board with an electromagnetic shielding film attached to the outer layer of the circuit board to prevent electromagnetic radiation is complicated and thick.

[0005] On the outer layer of the circuit board, an aluminum substrate is attached to prevent electromagnetic radiation. The grounding part of the circuit board is directly opened by laser and filled with conductive paste to complete the grounding. Prone to gaps and therefore less effective shielding

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