Method for integrating and mounting satellite-borne TR assembly arrays with high heat flux density

Abstract

The invention relates to the technical field of heat dissipation for satellite-borne phased array equipment, and discloses a method for integrating and mounting satellite-borne TR assembly arrays withhigh heat flux density. The method includes procedures of clamping a high-speed uniform-temperature heat conduction heat pipe between every two TR assemblies, leading out the corresponding TR assemblies at two ends of each heat pipe and forming independent TR assembly modules; arranging U-shaped left hoops and U-shaped right hoops for integrating and mounting the independent TR assembly modules;integrating the corresponding N independent TR assembly modules by each left hoop and the corresponding right hoop. The N is a natural number larger than 1. The technical method has the advantages that TR assembly array integrated heat dissipation systems are used in satellite-borne platforms by the aid of the method for the first time; the problems of internal volume and weight restriction and the like of satellite-borne phased array antennas can be solved by the aid of the method; integral satellite-borne phased array antennas have the total heat dissipation capability of 200 W under the condition that temperature intervals ranging from 35 DEG C to 55 DEG C are provided on heat sink surfaces, the temperatures are not higher than 85 DEG C all along after heating chips in the TR assembliesare in stable states, and accordingly the phase congruency of phase units can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of space-borne phased array equipment, in particular to an integrated installation method of a space-borne high heat flux TR component array. Background technique [0002] The usual structural design method for array integration and heat dissipation of TR components is to combine independent TR units to form TR components, and then install the components into the chassis. Due to its high level of integration, it results in high local heat generation and low heat conduction efficiency. When large-scale arrays form antenna arrays, it is usually necessary to design complex mounting accessories and equip them with liquid-cooled bottom plates or air-cooled channels. The equipment produced by this structural design method is often too large in size and heavy in weight, and it is not easy to meet the requirements of system integration and miniaturization when selecting the installation platform ...

AI Technical Summary

Problems solved by technology

Due to its high level of integration, it results in high local heat generation and low heat conduction efficiency. When large-scale arrays form antenna arrays, it is usually necessary to design complex mounting accessories and equip liquid-cooled bottom plates or air-cooled channels.

The equipment produced by this structural design method is often too large in size and heavy in weight. It is not easy to meet the needs of system integration and miniaturization when selecting the installation platform and the internal location of the platform.

Since space-borne products cannot adopt liquid cooling and air-cooling for heat dissipation, the traditional structure and thermal design cannot meet the high-density heat dissipation requirements of aerospace. Therefore, an integrated installation method for space-borne high heat flux TR component arrays was invented.

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