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A kind of linear voltage regulator thermal resistance test method

A technology of linear voltage regulator and testing method, which is applied in the direction of electronic circuit testing, instrumentation, measuring electricity, etc., can solve the problems of lack of thermal resistance testing ability of linear voltage regulator, and achieve simple structure, easy operation, and high testing accuracy Effect

Active Publication Date: 2020-10-09
XIAN MICROELECTRONICS TECH INST
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Problems solved by technology

[0003] At present, the existing test resources do not have the testing capability of the thermal resistance of linear voltage regulators. The present invention mainly aims at testing the junction-to-case thermal resistance of linear voltage regulators, and proposes a method for testing the thermal resistance of linear voltage regulators. The method The proposal will enhance the application and development of high-current, high-power-density linear regulators in the field of power management technology, and provide reliability guarantee for the change of this series of high-power circuits to serve the development of high-tech electronic technology industry

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  • A kind of linear voltage regulator thermal resistance test method
  • A kind of linear voltage regulator thermal resistance test method
  • A kind of linear voltage regulator thermal resistance test method

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Embodiment Construction

[0030] Thermal resistance is a parameter that characterizes the heat dissipation capability of a device. It is the ratio of the temperature difference along the heat flow path of the device to the dissipated power that generates the temperature difference under the condition of thermal equilibrium, that is, the resistance on the heat conduction path, which means that the power heat of 1W is emitted during the heat conduction process. , the temperature difference between the two ends of the thermal circuit. According to the definition of junction-to-case thermal resistance, the parameters to be measured include junction temperature, case temperature and power dissipation. The shell temperature can be directly measured, and the power dissipation can be calculated by applying voltage and current.

[0031] see figure 1 , the present invention a kind of linear regulator thermal resistance testing method, comprises the following steps:

[0032] S1. Oil bath method to test the junc...

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Abstract

The invention discloses a heat resistance testing method for a linear voltage stabilizer. The heat resistance testing method comprises the steps that a chip junction temperature testing structure of the linear voltage stabilizer is constructed, and the chip junction temperature of the linear voltage stabilizer is tested through an oil bath method; then a junction-to-case heat resistance testing structure of the linear voltage stabilizer is constructed for testing the junction-to-case heat resistance of the linear voltage stabilizer, and the case temperature and the power applied by a device are determined; and finally, the junction-to-case heat resistance of the linear voltage stabilizer is calculated. The heat resistance testing method is easy and convenient to operate, concise in structure, easy to implement and low in cost, the forward voltage drop of a diode is adopted to represent the chip junction temperature, and testing precision is high.

Description

technical field [0001] The invention belongs to the technical field of analog integrated circuit testing, and in particular relates to a thermal resistance testing method of a linear voltage regulator. Background technique [0002] Linear regulators are an important part of today's electronic systems. They are currently developing in the direction of high current, high power density, and high efficiency. They have the characteristics of low noise, simple application, and high reliability. They have always been important in the field of power management. component. The linear voltage regulator is a high-power linear integrated circuit. Due to the characteristics of the circuit structure, its own power dissipation is relatively large. The chip temperature is high during high-power use, and the thermal resistance from junction to case affects the power usage of the linear voltage regulator. Therefore, it is necessary to test its junction-to-case thermal resistance to provide a...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01N25/20
CPCG01N25/20G01R31/2875G01R31/2884
Inventor 季轻舟
Owner XIAN MICROELECTRONICS TECH INST
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