Audio processing device, chip, system and method

A technology for audio processing and audio signals, which is applied in the field of audio processing devices, can solve the problems of poor noise suppression in audio processing circuits, and achieve the effects of improving quality, suppressing common-mode noise signals, and improving filtering effects

Active Publication Date: 2019-01-25
ZHUHAI JIELI TECH
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide audio processing devices, chips, systems and methods for the technical problem of poor noise suppression in audio processing circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Audio processing device, chip, system and method
  • Audio processing device, chip, system and method
  • Audio processing device, chip, system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0047] figure 2 It is a schematic diagram of the first structure of an audio processing device provided by an embodiment of the present invention, as shown in figure 1 As shown, the audio processing ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to an audio processing device, a chip, a system and a method. The audio processing device comprises a bias and differential conversion module, a filter adjustment module and a differential amplification module. According to the bias power supply and the like, the bias and differential conversion module compares the ambient noise signal of the sound pickup device, producing mutually symmetrical common-mode noise signals. By improving the frequency response characteristics of the filter adjustment module, the filter adjustment module can improve the filtering effect of theaudio signal with a capacitor with a smaller capacitance value, and the characteristic of the differential amplification module is utilized to amplify the differential mode signal to reject the commonmode signal, reject the common mode noise signal, and improve the quality of the audio signal output by the sound pickup device.

Description

technical field [0001] The invention relates to the technical field of audio processing, in particular to an audio processing device, chip, system and method. Background technique [0002] figure 1 It is a schematic structural diagram of an audio processing circuit of traditional technology. Traditional audio processing circuits often use a single-ended amplifier circuit 10, and the quality of the audio signal is improved by connecting a capacitor C0 in series between the microphone MIC and the single-ended amplifier circuit 10. The digital conversion module ADC is used to collect the audio signal processed by the single-ended amplifier circuit 10 . However, the single-ended amplifier circuit 10 has a poor ability to suppress common-mode noise, and needs a coupling capacitor C0 with a larger capacitance in series to improve the low-frequency frequency response characteristics of the audio signal. The greater the cost of processing circuitry. Due to the large volume, it is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H04R3/00
CPCH04R3/00H04R2430/00
Inventor 黄海涛王艺辉
Owner ZHUHAI JIELI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap