A flip-chip interconnection method of a long-line array dual-detector chip

Abstract

The invention provides a flip-chip interconnection method of a long-line dual-detector chip, which comprises the following steps: a pressure arm of a flip-chip bonding machine sucks up the detector chip through a preset suction sheet tool; A pressure arm is used to bond the detector chip to a corresponding position of the readout circuit, wherein the preset suction sheet tool comprises a flat plate, an air suction hole and a boss located on the flat plate, wherein the air suction hole penetrates the air suction plate and the boss, the height of the boss is greater than the thickness of the detector chip, the width of the boss is smaller than or equal to the width of the detector chip, and the length of the boss is longer than or equal to the length of the detector chip. The technical proposal of the invention effectively avoids the interconnection of the second long-line array chips, Suction tool may affect the impact of the first chip which has been interconnected, so that the flip chip interconnect process can maintain good interconnect conductivity and high consistency in Z direction of the two chips after interconnection, which contributes greatly to the improvement of interconnect conductivity of the two chips.

Description

technical field [0001] The invention relates to the technical field of photoelectric detection, in particular to a method for flip-chip interconnection of long line array double detector chips. Background technique [0002] Mercury cadmium telluride is an important material for infrared detection devices. After decades of development, the chip structure has developed from unit and multi-element to one-dimensional line array and two-dimensional area array focal plane array. At present, the research on short-wave, medium-wave, long-wave and very long-wave infrared focal plane detectors has entered the application stage, and a large number of mercury cadmium telluride infrared focal plane detectors of various specifications have been equipped in various systems. [0003] In the manufacturing process of mercury cadmium telluride long-line infrared detectors, chip interconnection is a very important process step, and the interconnection conduction effect of the interconnection pr...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the blindness caused by the mechanical impact of the suction tool on the first chip and the lifting of the first chip when the second chip is interconnected during the flip-chip interconnection process of the two chips on the single readout circuit module To solve the problem of a sharp increase in the number of elements, the present invention provides a method for flip-chip interconnection of long line array dual detector chips

Images