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A kind of tapered array flexible electrode and preparation method thereof

A flexible electrode and tapered technology, applied in the field of biomedical engineering, can solve the problems of easy disconnection of the conductive layer, shedding, and affecting the efficiency of electrode stimulation

Active Publication Date: 2021-04-09
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, due to the poor adhesion between the metal of the conductive layer and the substrate, the traditional electrode processing method is prone to disconnection or the problem of conductive layer falling off, which greatly affects the stimulation efficiency of the electrode; in addition, the flexible microelectrode has a small surface area. Higher impedance, and during the long-term implantation process, the reactive colloid wrapping at the interface between flexible microelectrodes and nerve cells will further increase the impedance

Method used

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  • A kind of tapered array flexible electrode and preparation method thereof
  • A kind of tapered array flexible electrode and preparation method thereof
  • A kind of tapered array flexible electrode and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0051] A tapered array flexible electrode comprises a flexible polymer substrate and a metal conductive layer attached to the substrate. The material of the flexible polymer base is polyethylene terephthalate, and the surface of one side of the flexible polymer base has a nano-conical array structure, the height of the cone is 560nm, the diameter of the bottom is 290nm, and the outer circumference of the cone is The surface is a rough surface, the material of the metal conductive layer is gold, and the thickness of the metal conductive layer is 180nm.

[0052] Such as figure 1 Shown, the preparation method of this tapered array flexible electrode comprises the following steps:

[0053] (1) Take the polyethylene terephthalate flexible substrate 10, clean its surface to remove surface dust and impurities, and dry it with nitrogen gas for later use;

[0054] (2) Carry out oxygen plasma treatment to the surface of polyethylene terephthalate 10 to make its surface hydrophilic, an...

Embodiment 2

[0058] The difference between the tapered array flexible electrode of this embodiment 2 and the embodiment 1 is that the tapered height of the nano tapered array structure on the surface of the flexible polymer substrate is 600nm, the bottom diameter is 240nm, and the thickness of the metal conductive layer is 55nm.

[0059] The preparation method of the conical array flexible electrode of this embodiment is basically the same as that of Embodiment 1, the only difference is that this embodiment uses polystyrene microspheres with a diameter of 1 μm as a template, and the specific parameters of plasma etching and magnetron sputtering The process parameters of injection are different.

[0060] The electron microscope image of the nano-conical array structure on the surface of the flexible polymer substrate prepared in this example is as follows Figure 3a As shown, the electron microscope image of the final tapered array flexible electrode is as follows Figure 3b shown.

Embodiment 3

[0062] A tapered array flexible electrode comprises a flexible polymer substrate and a metal conductive layer attached to the substrate. The material of the flexible polymer base is polyethylene terephthalate, and the surface of one side of the flexible polymer base has a nano-conical array structure, the height of the cone is 690nm, the diameter of the bottom is 380nm, and the outer circumference of the cone is The surface is a rough surface, the material of the metal conductive layer is platinum, and the thickness of the metal conductive layer is 160nm.

[0063] The preparation method of the tapered array flexible electrode in this example is basically the same as that in Example 1, the only difference is that this example uses polystyrene microspheres with a diameter of 1 μm as a template, and the target material for sputtering to prepare a metal conductive layer is a platinum target materials, and the specific parameters of plasma etching are different from those of magnet...

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Abstract

The invention provides a tapered array flexible electrode, which includes a flexible polymer substrate and a metal conductive layer, and one side surface of the flexible polymer substrate has a micro-nano tapered array structure, wherein the outer peripheral surface of the micro-nano tapered shape is rough surface; the metal conductive layer completely covers the outer peripheral surface of the micro-nano-cone, and completely covers the area on the side surface of the flexible polymer substrate where the micro-nano-cone is not provided. The flexible polymer substrate of the flexible electrode has good adhesion between the metal conductive layer, stable structure, low electrode impedance and excellent electrochemical performance. The flexible electrode can be well applied in flexible electronic skin and implantable electrodes. The invention also provides a preparation method of the tapered array flexible electrode.

Description

technical field [0001] The invention relates to the technical field of biomedical engineering, in particular to a tapered array flexible electrode and a preparation method thereof. Background technique [0002] Flexible microelectrodes help patients perform functional reconstruction by applying pulsed current stimulation to specific nerve tissues, and have been widely used in medical devices such as cochlear implants and artificial retinas. The adhesion between the substrate and the conductive layer in flexible microelectrodes and the low impedance of the interface between flexible microelectrodes and nerve cells play a crucial role in ensuring stable and reliable long-term electrical stimulation / signal recording of flexible microelectrodes. [0003] However, due to the poor adhesion between the metal of the conductive layer and the substrate, the traditional electrode processing method is prone to disconnection or the problem of conductive layer falling off, which greatly a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/04B81B3/00B81C1/00
CPCB81B3/00B81B7/04B81C1/00166
Inventor 杜学敏陈洪旭
Owner SHENZHEN INST OF ADVANCED TECH
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