Printed circuit board, electronic device and production process thereof

A technology for printed circuit boards and electronic devices, applied in the field of electronics, can solve problems such as connecting tin, and achieve the effect of improving pressure resistance and realizing automatic mass production.

Inactive Publication Date: 2019-01-11
NEW H3C TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the objectives of the present invention is to provide a printed circuit board, which can effectively improve the problem of tin connection caused by flattening solder balls caused by high temperature deformation of electronic devices
[0004] Another object of the present invention is to provide an electronic device, which can effectively solve the problem of tin connection caused by flattening solder balls due to high temperature deformation of electronic devices during mounting
[0005] Another object of the present invention is to provide a production process of electronic equipment, which can effectively improve the problem of tin connection caused by flattening solder balls due to high temperature deformation of electronic devices during mounting

Method used

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  • Printed circuit board, electronic device and production process thereof
  • Printed circuit board, electronic device and production process thereof
  • Printed circuit board, electronic device and production process thereof

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Embodiment Construction

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0033] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The embodiment of the invention provides a printed circuit board, an electronic device and a production process thereof, which relate to the field of electronic technology. The printed circuit board is used for mounting electronic devices, and comprises a board body and a plurality of supports. Wherein, a mounting area for mounting electronic devices is arranged on the board body. A plurality of supports are attached to the mounting area for supporting the electronic device. The printed circuit board, the electronic equipment and the production process thereof provided by the embodiment of theinvention can effectively improve the problem of tin connection caused by the solder ball crushed due to high-temperature deformation during the mounting of the electronic device by supporting the electronic device, and the supporting member does not affect the mounting of the electronic device. In addition, the support is mounted in the mounting area, which can realize automatic mass productionand improve the compression resistance of electronic devices in the assembly process.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a printed circuit board, electronic equipment and a production process thereof. Background technique [0002] With the development of products, the functions of ball grid array package (BGA) chip integration are becoming more and more complex, which makes the size and weight of BGA chips larger and larger, and the size of BGA chip packages increases for the assembly of BGA chips. Machining presents enormous challenges. For example, the thermal deformation of BGA chip at high temperature may flatten the solder balls, causing the solder balls to solder. Contents of the invention [0003] One of the objectives of the present invention is to provide a printed circuit board, which can effectively solve the problem of tin connection caused by flattening solder balls caused by high temperature deformation of electronic devices during mounting. [0004] Another object of the pres...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 姜田子
Owner NEW H3C TECH CO LTD
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