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Solder paste composition containing bismuth alloy

A composition and alloy technology, used in metal processing equipment, welding media, welding/cutting media/materials, etc., can solve the problems of poor oxidation resistance, inability to meet process performance and welding performance at the same time, and high brittleness. The effect of environmental protection performance, expansion performance and welding performance, and strong oxidation resistance

Active Publication Date: 2019-01-08
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There is a contradiction between the solderability and stability of ordinary solder paste, resulting in that the process performance and soldering performance cannot be satisfied at the same time
[0004] The quality of tin alloy powder directly affects the quality of solder paste. At present, the tin alloy powder on the market still has the following problems, such as poor oxidation resistance, high brittleness, insufficient toughness, easy vibration failure, and poor corrosion resistance. Therefore, , there is an urgent need in this field to develop a new type of solder paste composition that is environmentally friendly, corrosion-resistant, strong in oxidation resistance, excellent in stability and reliability, and has excellent performance

Method used

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  • Solder paste composition containing bismuth alloy
  • Solder paste composition containing bismuth alloy
  • Solder paste composition containing bismuth alloy

Examples

Experimental program
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Effect test

preparation example Construction

[0068] In order to solve the above problems, a second aspect of the present invention provides a method for preparing a bismuth-based alloy solder paste composition, the preparation method comprising the following steps:

[0069] A1: Preparation of tin alloy powder;

[0070] A2: Preparation of soldering paste: Mix rosin, solvent, thickener, activator, corrosion inhibitor and protective agent in the formula, heat until dissolved, stir evenly, and cool to room temperature to obtain soldering paste;

[0071] A3: Preparation of the bismuth-based alloy-containing solder paste composition: mix the solder paste and tin alloy powder in proportion to obtain the bismuth-based alloy-containing solder paste composition.

[0072] During the whole preparation process, there is no limit to the heating temperature and time, the purpose is to dissolve, and there is no limit to the stirring time and stirring speed, the purpose is to stir evenly, and the room temperature refers to 20±5°C.

[00...

Embodiment 1

[0099] The first aspect of Example 1 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to the tin alloy is 12%.

[0100] In terms of weight percentage, tin alloy powder contains:

[0101] Ag 3.25%, P 0.45%, RE 0.55%, Co 1.25%, Pd 2.5%, Bi 50%, Mg 0.1%, Al 0.1%, Cu 0.95%, Zr 0.65%, In 0.35%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.

[0102] In terms of parts by weight, the solder paste contains the following components:

[0103] 35 parts of rosin, 35 parts of solvent, 8 parts of thickener, 6 parts of active agent, 3 parts of corrosion inhibitor and antioxidant and 3 parts of protective agent. The rosin is selected from disproportionated rosin; the solvent is selected from the combination of tetraethylene glycol methyl ether and tripropylene glycol methyl ether in parts by weight; the thickener is selected from palm wa...

Embodiment 2

[0118] The first aspect of Example 2 provides a bismuth-based alloy-containing solder paste composition, including solder paste and tin alloy powder, and the weight ratio of the solder paste to tin alloy is 12%.

[0119] In terms of weight percentage, tin alloy powder contains:

[0120] Ag 3%, P 0.02%, RE 40%, Co 1%, Pd 2%, Bi 0.4%, Mg 0.05%, Al 0.05%, Cu0.8%, Zr 0.5%, In 0.3%, and the rest is Sn. Among them, the RE component is a combination of Ga and Ce at a ratio of 1:1.

[0121] The composition of the flux paste is the same as in Example 1. The preparation method of the protective agent is the same as in Example 1.

[0122] The second aspect of Example 2 provides a preparation method of a bismuth-based alloy-containing solder paste composition, the preparation method is the same as that of Example 1, and the preparation method of the tin alloy is also the same as that of Example 1.

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Abstract

The invention provides a solder paste composition containing bismuth alloy. The solder paste composition comprises soldering flux and tin alloy powder, and the weight ratio of the soldering flux to the tin alloy powder is 9-15%. A protective agent is added into the soldering flux, a layer of protective film can be formed, small molecule precipitation is prevented, in the welding process, pores areformed at the high temperature, small molecules are adsorbed, and damage to human bodies and environment can be prevented. The solder paste composition is environmentally friendly, good in performance, high in oxidation resistance, free of lead, and good in expansibility and welding performance.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a bismuth-based alloy solder paste composition. Background technique [0002] Solder paste, also called solder paste, is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, solder paste, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] There is a contradiction between the solderability and stability of common solder pastes, resulting in that the process performance and soldering performance cannot be satisfied at the same time. [0004] The quality of tin alloy powder directly affects the quality of solder paste. At present, the tin alloy powder on the market still has the following problems, such as poor oxidation resistance, high brittleness, insufficient toughness, easy vibration failure, and poor co...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363B23K35/40
CPCB23K35/262B23K35/362B23K35/40
Inventor 陈钦罗登俊徐华侨张义宾梁少杰徐衡陈旭
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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