Heat dissipation substrate and preparation method thereof

Abstract

The invention relates to a heat dissipation substrate and a preparation method thereof. The heat dissipation substrate comprises an insulating substrate, a metal conductive member embedded in the insulating substrate, a patterned conductive layer formed on the upper surface of the insulating substrate and a metal heat dissipation layer formed on the lower surface of the heat dissipation substrate.A power device mounting pad exposed to an insulating substrate is formed on an upper surface of the metal conductive member, and a ceramic heat conductive member is disposed between the metal conductive member and the metal heat dissipation layer. As that heat dissipation substrate can simultaneously carry power devices and non-power device, the heat dissipation substrate is convenient to realizeminiaturization, and has good heat dissipation performance and voltage withstand performance. The preparation method comprises the steps of molding an insulating substrate by hot pressing and embedding a metal conductive member and a ceramic heat dissipation member in the insulating substrate, the preparation process is simple and the cost is low.

Description

technical field [0001] The invention relates to a heat dissipation substrate and a preparation method thereof. Background technique [0002] Semiconductor power devices such as thyristors, GTOs (gate turn-off thyristors), GTRs (power transistors), IGBTs (insulated gate bipolar transistors), MOSFETs (power field effect transistors) and power diodes usually carry loads during operation. A large current generates a large amount of heat. In order to avoid heat accumulation to form high temperature and affect its performance, the heat generated by power semiconductor devices needs to be dissipated in time by the heat dissipation substrate as its electrical connection and mechanical bearing substrate. [0003] With the development of electronic / power products in the direction of light conversion and small conversion, more and more electronic / electric products are designed such as semiconductor power devices and non-power devices such as voltage stabilization / rectification / filter d...

AI Technical Summary

Problems solved by technology

[0005] In the above prior art, on the one hand, both the thick copper circuit area and the thin copper circuit area are arranged on the surface of the heat dissipation substrate, resulting in a larger wiring area required by the heat dissipation substrate, which is not conducive to the miniaturization of the heat dissipation substrate; on the other hand, the ceramic The heat sink passes through the thick copper line area, and the heat in the thick copper line area is difficult to spread quickly through the ceramic heat sink

In addition, the above-mentioned preparation method of the heat dissipation substrate needs to provide the first core board and the second core board, the preparation process is complicated and the cost is high

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