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camera module

A camera module and circuit board technology, which is applied in the directions of image communication, television, and printed circuits connected with non-printed electrical components, can solve problems such as size reduction and structural limitations, avoid virtual welding, and avoid high and low inconsistencies. the effect of one

Active Publication Date: 2021-01-05
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, due to structural limitations, it is difficult to meet the requirements of further size reduction, so a camera module with a smaller volume is needed to meet the requirements.

Method used

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Embodiment approach

[0027] figure 1 is a front view schematically showing a camera module according to an embodiment of the present invention. As shown in the figure, according to an embodiment of the present invention, the camera module includes a circuit board body 1 , components 2 , a main body 3 and a chip 4 . In this embodiment, both the main body 3 and the chip 4 are supported on the upper surface of the circuit board body 1 . The main body 3 is a cylinder with a cavity, which can be fixed and supported on the circuit board body by bonding, fitting, etc. The main body 3 contains both the components 2 and the chip 4 in its cavity, and the main body 3 also needs to be supported The imaging unit (not shown in the figure) thus constitutes a complete camera module. At the same time, the components 2 and the chip 4 also need to be electrically connected to the circuit board body. In this embodiment, the component 2 may use a capacitor.

[0028] figure 2 yes figure 1 Schematic diagram of th...

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PUM

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Abstract

The invention relates to a camera module, comprising a circuit board body, components, a main body and a chip, the main body and the chip are supported on the upper surface of the circuit board body, and the upper surface of the circuit board body is partially Shen forms an accommodating cavity, and the components are vertically implanted into the accommodating cavity; the inner surface of the accommodating cavity, and the upper surface of the circuit board body are provided with soldering pads near the accommodating cavity; The accommodating cavities are arranged in a linear arrangement, and the wall thickness between adjacent accommodating cavities is 0.1mm-1.0mm. According to the present invention, the internal space of the circuit board body is fully utilized and the total height of the components and the circuit board body is effectively reduced, thereby further reducing the overall height of the camera module.

Description

technical field [0001] The invention relates to a camera module, in particular to a component implanted camera module. Background technique [0002] At present, with the advancement of science and technology, the update speed of electronic equipment products is getting faster and faster. Taking the mobile phone industry as an example, with the emergence of mobile phones with the concept of "full screen", "full screen" mobile phones have now become the focus of everyone's attention. At the same time, the emergence of "full-screen" mobile phones poses new challenges to the size of mobile phone camera modules, requiring the X-axis and Y-axis of the camera module to be as small as possible. The camera module in the prior art is difficult to meet the requirement of further size reduction due to structural limitations, so a camera module with a smaller volume is needed to meet the requirements. Contents of the invention [0003] The object of the present invention is to provid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H05K1/18
CPCH05K1/183H04N23/50H04N23/54
Inventor 易峰亮吴业王雅菲
Owner NINGBO SUNNY OPOTECH CO LTD
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