Welding method for sputtering target material

Abstract

The invention discloses a welding method for a sputtering target material. The welding method for the sputtering target material comprises the following steps: (1) a welding gap between a sputtering target material main material and an auxiliary material is adjusted to be smaller than or equal to 0.3 mm; and (2) a stirring friction welding machine is used to conduct welding; the depth of a rotational cutting tool of the stirring friction welding machine inserted into the welding gap is 10.5-11 mm; welding is conducted rotatably by the rotational cutting tool; and when welding is conducted rotatably by the rotational cutting tool, the auxiliary material rotates with the main material. The welding method for the sputtering target material has the advantages that the cost of raw materials formanufacturing the sputtering target material is saved; moreover, high welding rate is guaranteed; by adopting the welding method, the cost is also lowered when large-scale production is conducted; thus the low-cost sputtering target material can be produced in a large scale; and when the target material is used for manufacturing chips again, the manufacturing cost of the chips is lowered greatly.

Description

technical field [0001] The invention belongs to the technical field of target welding, in particular to a sputtering target welding method. Background technique [0002] The sputtering target refers to the use of an electron gun system to emit and focus electrons on the material to be plated, so that the sputtered atoms follow the principle of momentum conversion and fly away from the material to the substrate to deposit a film with high kinetic energy. The material to be plated is called a sputtering target. The sputtering target is divided into two types: installation and use according to the purpose. It can also be called the auxiliary material for installation and the main material for use. In the prior art, the sputtering target is integrated. Molding requires a large piece of raw material to be made, and the cost of the raw material is extremely high. The high cost makes the sputtering target also pay a high cost when manufacturing chips, which is not conducive to the ...

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Problems solved by technology

[0003] In order to solve the defects in the prior art that the cost of the sputtering target itself is high and restrict the development of chip manufacturing, the present invention provides a sputtering target welding method, the purpose of which is to combine the sputtering target in the prior art One-piece molding, replace the sputtering target auxiliary material with relatively cheap aluminum and other materials, and then weld the aluminum auxiliary material and the sputtering target main material, which saves the cost of raw materials, and the welding method adopted is in the scale The cost will also be reduced during large-scale production, so that low-cost sputtering targets can be produced on a large scale, and when the target is used in chip manufacturing, the cost of chip manufacturing will be greatly reduced

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